Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | ABS.PC.MPPO...etc |
| Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C |
| Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts |
| Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack |
| Model Number | 4Inch |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 4500~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30) |
| Material | ABS.PC.MPPO...etc | Color | Black.Red.Yellow.Green.White..etc |
| Temperature | General 80°C~100°C | Property | ESD,Non-ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Warpage | less than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Suitable for all kinds of Bar.Die.Chip devices or parts | Injection mold | Customized case need(Lead time 20~25Days,Mold Life Span: 450,000 times.) |
| Brand Name | Hiner-pack | Model Number | 4Inch |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | Waffle Pack Bare Die Tray ，MPPO Bare Die Tray ，Bare Die waffle tray | ||
ABS MPPO Waffle Pack Bare Die Tray 36PCS Optical Device Packaging
High Quality ABS Waffle Pack Based Internation Standard For Bare Wafer
In order to better protect the components or chips, choosing injection trays for packaging has become an alternative and option packaging solution. It can not only provide comprehensive protection for components, but also provide excellent products in terms of storage and transportation. Great advantage of convenience. At the same time, due to the reusable characteristics of plastic pallets, the products we produce can also be reused, and the waste of plastic after disposal can also be fully degraded, thereby eliminating some of the problems that need to be dealt with by environmental protection. Our company can Provide one-stop service from design to production to packaging, solve all the problems faced by packaging for your parts, choose high-quality professional suppliers, and reduce unnecessary after-sales troubles for you.
Waffle pack opening procedure discrete devices packaged in Waffle Packs normally have room to move around within the pocket. Sometimes parts may stick to the paper insert usually placed between the top of the package and the lid. Parts can easily jump out of an open package subject to small vibrations, static charge or strong airflow. Smaller parts are more susceptible to jumping out of, or being blown out of, the pockets of an open waffle pack.
HN21014-2 Detail Information:
As for HN2038,Usually used for loading small chips or components less than 13mm, carrying a large number of chips in a small volume. At the same time, the purchase of inch products can match the corresponding accessories such as cover, clip and Tyvek paper of the existing series, and the complete package is more easy to the transfer, transport and storage of the products.
| Outline Line Size | 101.57*101.57*3mm | Brand | Hiner-pack |
| Model | HN21014-2 | Package Type | IC Parts |
| Cavity Size | 13*13mm | Matrix QTY | 6*6=36PCS |
| Material | ABS | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
Our Advantages
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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