Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | MPPO |
| Color | Black |
| Temperature | 150°C |
| Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω |
| Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Support standard and non-standard,precision machining |
| Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
| Brand Name | Hiner-pack |
| Model Number | HN21116 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Shenzhen China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 2500PCS~3000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm |
| Material | MPPO | Color | Black |
| Temperature | 150°C | Property | ESD |
| Surface resistance | 1.0x10E4~1.0x10E11Ω | Flatness | less than 0.76mm |
| Clean Class | General and ultrasonic cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Customized service | Support standard and non-standard,precision machining | Injection mold | Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.) |
| Brand Name | Hiner-pack | Model Number | HN21116 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Shenzhen China |
| High Light | Matrix JEDEC Trays ，Electronic Parts JEDEC Trays ，Jedec Matrix Trays 0.76mm | ||
12*30 Matrix Black MPPO JEDEC Trays for Electronic Parts
The "JEDEC tray" (Joint Electron Device Engineering Council) is a common name for a standardized tray form-factor used to securely hold and transport electronic components. The trays have different matrix designs depending on the size of the loaded product. The matrix is made up of multiple matrix pockets and Spacing between matrix pockets is determined by the component size.
The trays are generally injection-molded to support high-quantity and quick manufacture.Because of the particularity of this kind of plastic products, this kind of tray can not only be reused many times, but also can meet the degradation requirements of waste materials after damage. The product is completely harmless to nature after degradation and has no impact on customer products and the environment.
Details of the HN21116 JEDEC Tray
The main material of HN21106 tray is MPPO, which is a material with good stability and heat resistance. The product not only has good thermal stability to avoid high temperature cracking phenomenon, but also fully comply with ROHS environmental standards. Raw materials can be recycled and easily degrade after waste.
Compared with ordinary products, our trays are small in size and light in weight. The matrix design of 12*30 can hold more products and reduce the transportation cost of customers.At the same time, we can also provide a variety of customized service according to your chip products. The custom trays are not only suitable for storing integrated circuit products, but also better for protecting electronic devices in different environments.
| Outline Line Size | 322.6*135.9*7.62mm | Brand | Hiner-pack |
| Model | HN21116 | Package Type | Die |
| Cavity Size | 5.3*5.3*2.76 | Matrix QTY | 12*30=360PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Place of origin | CHINA |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application of the HN21116 Matrix Tray
Test and Measurement Technology Mechanical and electrical equipment
Power supply Sensor
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
Advantages
1.Flexible OEM service: we can produce products according to customer’s sample or design.
2.Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3.Complicated workmanship: tooling making, Injection molding,Production
4.Comprehensive customer service: from customer consultation to after sales service.
5.10 years experience of OEM for USA and EU customers.
6.We have our own factory and can control quality in high level and produce products quickly and flexibly.
FAQ
Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.
Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.
Q4: How about batch order production?
Ans: Normally 5-8 days or so.
Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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