Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | PC |
| Color | Black |
| Matrix QTY | 9*6=54PCS |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding |
| Brand Name | Hiner-pack |
| Model Number | HN22013 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | PC | Color | Black |
| Matrix QTY | 9*6=54PCS | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning | Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding | Brand Name | Hiner-pack |
| Model Number | HN22013 | Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA | ||
| High Light | Chip Storage Waffle Pack Trays ，4 Inch Waffle Pack Trays ，54PCS Waffle Pack Chip Trays | ||
Customized 4 Inch PC Waffle Pack Chip Tray For Chip Storage 54 PCS
The waffle pack is the carrier of semiconductor chip packaging, mainly used for the inspection, storage and transportation. Compared with other packaging methods, it can not only accommodate smaller products, but also have high temperature resistance, anti-static and other functions. The small size makes it very suitable for small-scale transportation, which is a modern production management of the necessary products.
At the same time, the service life of this waffle pack is 5-7 times longer than that of traditional packaging. In addition, it can also be recycled and there is no need for customer to worry about environmental pollution. Hiner-pack is a professional tray manufacturer. From design drawing, mold manufacturing, production to packaging, all steps and operations have strict quality control. We sincerely hope to bring you the quality service.
The Details Of The HN22013 Waffle Pack
HN22013 Waffle pack is mainly made of PC material, which is a widely used industrial material. The waffle pack made of this material has good structural stability, heat resistance and other properties. The tray is evenly distributed with matrix pockets, the professional matrix design to achieve the most reasonable loading. Customers can choose the right waffle pack according to their product size. At the same time, the 45 degrees chamfer design can effectively prevent stacking errors and correct the placement direction of products. This waffle pack is not only light in weight but also small in size, which greatly reduces shipping and packaging costs for customers.
| Outline Line Size | 101.6*101.6*5.5mm | Brand | Hiner-pack |
| Model | HN22013 | Package Type | Die |
| Cavity Size | 12.65*7.65*1.43 | Matrix QTY | 9*6=54PCS |
| Material | PC | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of The HN22013 Chip Tray
IC Packaging Delivery Systems Embedded System
Micro and Anon System Semiconductor
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Advantages
1.Light weight, saving transportation and packaging costs.
2.Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3.Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4.High temperature resistance, suitable for high temperature automation equipment assembly.
5.Corrosion resistance, suitable for all kinds of production conditions of products.
6.Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.
7.Edge chamfer design, effectively prevent stacking error, correct the direction of placement.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Ans:Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Ans:Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Ans:Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
Ans:We can send you them right now if you are interested in something we have stock.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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