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Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
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China IC Packaging BGA IC Type Jedec IC Trays Black MPPO PPE ABS PEI IDP Material
China IC Packaging BGA IC Type Jedec IC Trays Black MPPO PPE ABS PEI IDP Material

  1. China IC Packaging BGA IC Type Jedec IC Trays Black MPPO PPE ABS PEI IDP Material
  2. China IC Packaging BGA IC Type Jedec IC Trays Black MPPO PPE ABS PEI IDP Material
  3. China IC Packaging BGA IC Type Jedec IC Trays Black MPPO PPE ABS PEI IDP Material
  4. China IC Packaging BGA IC Type Jedec IC Trays Black MPPO PPE ABS PEI IDP Material

IC Packaging BGA IC Type Jedec IC Trays Black MPPO PPE ABS PEI IDP Material

  1. MOQ: 1000 pcs
  2. Price: TBC
  3. Get Latest Price
Packaging Details 80~100pcs/carton
Delivery Time 1~2 Weeks
Payment Terms 100% Prepayment
Supply Ability 2000PCS/Day
Color Black
Size 322.6*135.9mm
IC Type BGA,QFP,QFN,LGA,PGA
Tray Features Stackable
Surface Resistance 1.0*10e4-1.0*10e11Ω
Tray Weight 120~200g
Application IC Packaging
Tray Shape Rectangular
Brand Name Hiner-pack
Model Number JEDEC TRAY SERIES
Place of Origin China
Certification ISO 9001 SGS ROHS

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  1. Product Details
  2. Company Details

Product Specification

Packaging Details 80~100pcs/carton Delivery Time 1~2 Weeks
Payment Terms 100% Prepayment Supply Ability 2000PCS/Day
Color Black Size 322.6*135.9mm
IC Type BGA,QFP,QFN,LGA,PGA Tray Features Stackable
Surface Resistance 1.0*10e4-1.0*10e11Ω Tray Weight 120~200g
Application IC Packaging Tray Shape Rectangular
Brand Name Hiner-pack Model Number JEDEC TRAY SERIES
Place of Origin China Certification ISO 9001 SGS ROHS
High Light IC Packaging Jedec IC TraysBGA Jedec IC TraysBlack IC matrix trays

Product Description:

JEDEC matrix trays generally have the same measurements, which are 12.7 x 5.35 inches (322.6 x 136mm).

The thickness of the low profile trays ranges from 0.25-inch (6.35mm). This size can easily fit most standard component, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC.

 

Features:

Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. With decades of history and familiarity, support products for JEDEC matrix trays are widespread and global.

Packaging – at their core, trays are simply containers. The JEDEC matrix tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.

Transportation & Storage – parts loaded into stacked JEDEC matrix trays are easy to store or transport, across the room or around the world. JEDEC matrix trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.

Protection – JEDEC matrix trays protect the parts they hold from mechanical damage. Most JEDEC matrix trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage. This protection helps assure the parts arrive in pristine condition.

Technical Parameters:

JEDEC Matrix Trays

are well-suited for automatically handling and protecting parts precisely in an automated environment. Ornemonents components in a well-defined pattern, they make automation and the correlated programming operations simpler. As JEDEC Matrix Trays are utilized for semiconductors, electronic components, optical and photonic items, and purely mechanical components.

The prime reasons for picking and placement automation and usage of standardized processing apparatus are the most common reasons why companies prefer of using JEDEC Matrix Trays. A majority of these trays are manufactured of ESD-safe engineering plastic.

 

Applications:

Hiner-pack's JEDEC TRAY SERIES are the perfect choice for Electronic Components IC Chips and ICs. With ISO 9001 SGS ROHS certification, the trays offer a minimum order quantity of 500, with a packaging option of 80~100pcs/carton. Delivery time is 1~2 Weeks, and payment terms are 100% Prepayment. The trays come with an impressive supply ability of 2000PCS/Day, and are made of quality materials such as MPPO.PPE.ABS.PEI.IDP. The tray shape is rectangular, with a height of 7.62mm, and they come in black. These trays are perfect for Grid Cable Tray and IC Tray packaging applications.

Customization:

Customized JEDEC IC Trays From Hiner-pack

Hiner-pack is proud to offer custom JEDEC IC Trays. Our JEDEC Tray Series are designed to meet the needs of any industry, and come with the following features:

  • Brand Name: Hiner-pack
  • Model Number: JEDEC TRAY SERIES
  • Place of Origin: China
  • Certification: ISO 9001 SGS ROHS
  • Minimum Order Quantity: 500
  • Price: TBC
  • Packaging Details: 80~100pcs/carton
  • Delivery Time: 1~2 Weeks
  • Payment Terms: 100% Prepayment
  • Supply Ability: 2000PCS/Day
  • Color: Black
  • Material: MPPO.PPE.ABS.PEI.IDP
  • Tray Features: Stackable
  • Size: 322.6*135.9mm
  • Height: 7.62mm
  • Core Tray Racking, Grid Cable Tray, Apple Tray Making Machine

Our custom JEDEC IC Trays are designed to meet the needs of any industry. Contact us today to learn more about our JEDEC Tray Series.

 

FAQ:

Q: What is the brand name of the Jedec IC Trays?
A: The brand name of the Jedec IC Trays is Hiner-pack.
Q: What is the model number of the Jedec IC Trays?
A: The model number of the Jedec IC Trays is JEDEC TRAY SERIES.
Q: Where is the Jedec IC Trays made?
A: The Jedec IC Trays are made in China.
Q: What certifications does the Jedec IC Trays have?
A: The Jedec IC Trays have ISO 9001 SGS ROHS certifications.
Q: What is the minimum order quantity for the Jedec IC Trays?
A: The minimum order quantity for the Jedec IC Trays is 500 pieces.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
  • https://www.jedecictrays.com/

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