Beijing Plink AI Technology Co., Ltd
| Payment Terms | L/C, D/A, D/P, T/T |
| Supply Ability | 20pcs 15-30 work days |
| Delivery Time | 15-30 work days |
| Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | UVA V2X Construction Nvidia AGX Orin Compute Module 64GB |
| Keyword | UVA V2X Construction Nvidia AGX Orin Compute Module 64GB |
| AI Performance | 275 TOPS |
| GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| Memory | 64GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 |
| Vision Accelerator | 1x PVA v2 |
| Other I/O | 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
| CPU Max Freq | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
| Power | 15W - 60W |
| Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| Brand Name | NVIDIA |
| Model Number | AGX orin 64G module |
| Place of Origin | USA |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | 20pcs 15-30 work days |
| Delivery Time | 15-30 work days | Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | UVA V2X Construction Nvidia AGX Orin Compute Module 64GB | Keyword | UVA V2X Construction Nvidia AGX Orin Compute Module 64GB |
| AI Performance | 275 TOPS | GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 | Memory | 64GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 | Vision Accelerator | 1x PVA v2 |
| Other I/O | 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs | CPU Max Freq | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
| Power | 15W - 60W | Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| Brand Name | NVIDIA | Model Number | AGX orin 64G module |
| Place of Origin | USA | ||
| High Light | UVA Nvidia AGX Orin ，64GB Nvidia AGX Orin ，64GB nvidia compute module | ||
UVA V2X Construction Nvidia AGX Orin Compute Module 64GB
NVIDIA Jetson AGX Orin Module (64G)
At the edge, IoT and mobile devices use embedded processors to collect data. Edge computing takes the power of AI directly to those devices and processes the captured data at its source—instead of in the cloud or data center. This accelerates the AI pipeline to power real-time decision-making and software-defined autonomous machines.
AI is Now Everywhere
As businesses across industries grapple with vast amounts of data, more complex operations, and more dynamic markets, edge AI is playing a growing role in helping them rapidly respond. Through a combination of computing power, AI technology, data analytics, and advanced connectivity, the edge extends compute capabilities from data centers out to the edge of networks, allowing organizations to act quickly on data where it’s captured. Reducing the distance between where data is captured and where it’s processed not only alleviates data transit costs, but also improves latency, bandwidth utilization, and infrastructure costs.
| Brand | NVIDIA |
| Module | NVIDIA Jetson AGX Orin 64GB |
| AI Performance | 275 TOPS |
| GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
| GPU Max Frequency | 1.3 GHz |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| CPU Max Frequency | 2.2 GHz |
| DLA Max Frequency | 1.6 GHz |
| DL Accelerator | 2x NVDLA v2 |
| Safety Cluster Engine | - |
| Memory | 64GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 |
| Display | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
| Camera | Up to 6 cameras (16 via virtual channels) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps) |
| Video Encode | 2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265) |
| Video Decode | 1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) |
| PCIe | Up to 2 x8 + 1 x4 + 2 x1 (PCIe Gen4, Root Port, & Endpoint) |
| Networking | 1x GbE 1x 10GbE |
| Power | 15W - 60W |
| Other I/O | 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs |
| Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
The rapid evolution of artificial intelligence (AI) and the proliferation of billions of IoT devices are transforming almost every industry. AI at the edge now enables use cases that we could only imagine until recently. Today, the NVIDIA Jetson™ platform brings incredible new capabilities to the edge, accelerating product development and deployment at scale.
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification：
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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