Beijing Plink AI Technology Co., Ltd
| Payment Terms | L/C, D/A, D/P, T/T |
| Supply Ability | 20pcs 15-30 work days |
| Delivery Time | 15-30 work days |
| Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | 1.3GHz PCIe AI Performance Jetson Nvidia AGX Orin Developer Kit Server Class |
| Keyword | 1.3GHz PCIe AI Performance Jetson Nvidia AGX Orin Developer Kit Server Class |
| PN Number | AGX ORIN 32G (945-13730-0000-000） |
| AI Performance | 275 TOPS |
| GPU | NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 tensor cores |
| CPU | 12-core Arm Cortex-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| PCIe | x16 PCIe slot: Lower x8 PCIe Gen4 |
| USB Micro-B | USB 2.0 |
| M.2 Key M | x4 PCIe Gen 4 |
| M.2 Key E | x1 PCIe Gen 4, USB 2.0, UART, I2S |
| Memory | 32GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 |
| USB Type-C | 2x USB 3.2 Gen2 with USB-PD support |
| Mechanical | 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution) |
| Brand Name | NVIDIA |
| Model Number | AGX orin 64G module |
| Place of Origin | USA |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | 20pcs 15-30 work days |
| Delivery Time | 15-30 work days | Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | 1.3GHz PCIe AI Performance Jetson Nvidia AGX Orin Developer Kit Server Class | Keyword | 1.3GHz PCIe AI Performance Jetson Nvidia AGX Orin Developer Kit Server Class |
| PN Number | AGX ORIN 32G (945-13730-0000-000） | AI Performance | 275 TOPS |
| GPU | NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 tensor cores | CPU | 12-core Arm Cortex-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| PCIe | x16 PCIe slot: Lower x8 PCIe Gen4 | USB Micro-B | USB 2.0 |
| M.2 Key M | x4 PCIe Gen 4 | M.2 Key E | x1 PCIe Gen 4, USB 2.0, UART, I2S |
| Memory | 32GB 256-bit LPDDR5 204.8 GB/s | Storage | 64GB eMMC 5.1 |
| USB Type-C | 2x USB 3.2 Gen2 with USB-PD support | Mechanical | 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution) |
| Brand Name | NVIDIA | Model Number | AGX orin 64G module |
| Place of Origin | USA | ||
| High Light | 1.3GHz Nvidia AGX Orin ，Nvidia AGX Orin Developer Kit ，nvidia jetson agx developer kit | ||
1.3GHz PCIe AI Performance Jetson Nvidia AGX Orin Developer Kit Server Class
NVIDIA Jetson AGX Orin developer kit is used by professionals to develop and test software for products based on Jetson AGX Orin modules, and by students and enthusiasts for projects and learning. Each developer kit includes a non-production specification Jetson module attached to a reference carrier board with standard hardware interfaces for flexible development and rapid prototyping.
Get started developing with the NVIDIA® Jetson AGX Orin™ Developer Kit. It can emulate the entire family of Jetson Orin modules, letting you create advanced robotics and edge AI applications for manufacturing, logistics, retail, service, agriculture, smart city, healthcare, and life sciences.
The NVIDIA Jetson AGX Orin Developer Kit and all Jetson Orin modules share one SoC architecture, enabling the developer kit to emulate performance and power for any of the modules. It is configured by default for those targeting Jetson AGX Orin series modules, but can be easily re-flashed to emulate Jetson Orin NX or Jetson Orin Nano series modules.
The included carrier board exposes many standard hardware interfaces, enabling a highly flexible and extensible platform for rapid prototyping.
NVIDIA Jetson AGX Orin Developer Kit enables development of full-featured AI applications for products based on Jetson Orin modules. It includes a high-performance, power-efficient NVIDIA Jetson AGX Orin module, and can emulate the other Jetson Orin modules.
AI Performance | 275 TOPS |
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
GPU Max Frequency | 1.3 GHz |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU |
CPU Max Frequency | 2.2 GHz |
Memory | 32GB 256-bit LPDDR5 |
Storage | 64GB eMMC 5.1 |
Video Encode | 2x 4K60 (H.265) |
Video Decode | 1x 8K30 (H.265) |
Camera | 16-lane MIPI CSI-2 connector |
PCI e | x16 PCIe slot supporting x8 PCIe Gen4 |
USB | USB Type-C connector: 2x USB 3.2 Gen2 |
Networking | RJ45 connector with up to 10 GbE |
Display | 1x DisplayPort 1.4a (+MST) connector |
Other I/O | 40-pin header (UART, SPI, I2S, I2C, CAN, PWM, DMIC, GPIO) |
Power | 15W - 60W |
Mechanical | 110mm x 110mm x 71.65mm |
Your Jetson AGX Orin Developer Kit includes:
NVIDIA Jetson AGX Orin module with heat sink and reference carrier board
802.11ac/abgn wireless Network Interface Controller
USB Type-C power supply
USB Type-C to USB Type-A cable
Quick Start and Support Guide
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification：
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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