Beijing Plink AI Technology Co., Ltd
| Payment Terms | L/C, D/A, D/P, T/T |
| Supply Ability | 20pcs 15-30 work days |
| Delivery Time | 15-30 work days |
| Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS |
| Keyword | Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS |
| AI Performance | 275 TOPS (INT8) |
| GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
| GPU Max Frequency | 1.3 GHz |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| CPU Max Freq | 2.2 GHz |
| Memory | 64GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 |
| Other I/O | 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
| Power | 15W - 60W |
| Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| Brand Name | NVIDIA |
| Model Number | AGX orin 64G module |
| Place of Origin | USA |
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | 20pcs 15-30 work days |
| Delivery Time | 15-30 work days | Packaging Details | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| NAME | Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS | Keyword | Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS |
| AI Performance | 275 TOPS (INT8) | GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
| GPU Max Frequency | 1.3 GHz | CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| CPU Max Freq | 2.2 GHz | Memory | 64GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 | Other I/O | 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
| Power | 15W - 60W | Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| Brand Name | NVIDIA | Model Number | AGX orin 64G module |
| Place of Origin | USA | ||
| High Light | Nvidia AGX Orin Multi Chip Module ，Intelligent 64G Multi Chip Module ，275 TOPS Mcm Multi Chip Module | ||
Intelligent Nvidia AGX Orin 64G Multi Chip Module GPU 2048 Core 275 TOPS
NVIDIA Jetson AGX Orin 64GB Multi Chip Module
275 Sparse | 138 Dense INT8 TOPS | 15W to 60W
Robots create new efficiencies and improve quality of life through industries such as manufacturing, logistics, healthcare, and service. NVIDIA Isaac™ accelerates the process with enhanced robotics development, simulation, and deployment.
Accelerating and enhancing robotics—from development to simulation to deployment.
From smart automation in manufacturing to last-mile delivery, robots are becoming more ubiquitous in everyday life. However, industrial and commercial robotics development can be complex, time consuming, immensely challenging, and expensive. Unstructured environments across many use cases and scenarios are also common. The NVIDIA Isaac™ robotics platform addresses these challenges with an end-to-end solution to help decrease costs, simplify development, and accelerate time to market.
| Module | NVIDIA Jetson AGX Orin 64GB |
| AI Performance | 275 TOPS |
| GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
| GPU Max Frequency | 1.3 GHz |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU |
| CPU Max Frequency | 2.2 GHz |
| DL Accelerator | 2x NVDLA v2 |
| DLA Max Frequency | 1.6 GHz |
| Vision Accelerator | 1x PVA v2 |
| Memory | 64GB 256-bit LPDDR5 |
| Storage | 64GB eMMC 5.1 |
| Camera | Up to 6 cameras (16 via virtual channels) |
| Video Encode | 2x 4K60 (H.265) |
| Video Decode | 1x 8K30 (H.265) |
| PCIe | Up to 2 x8 + 1 x4 + 2 x1 |
| Networking | 1x GbE |
| Power | 15W - 60W |
| Mechanical | 100mm x 87mm |
The end-to-end Isaac robotics platform.
Accelerate the development process with enhanced robotics development, simulation, and deployment.
| Temperature range (at Thermal Transfer Plate (TTP) surface) | -25 °C to 80 °C |
| Operating humidity | 5% to 85% RH |
| Storage temperature (Ambient)1 | -25 °C to 80 °C |
| Storage humidity | 30% to 70% RH |
Note: See the NVIDIA Jetson AGX Orin Design Guide for details on the UPHY configurations supported. MGBE, USB 3.2, and PCIe share UPHY Lane.
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification：
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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