Payment Terms | L/C, D/A, D/P, T/T |
Supply Ability | In stock |
Delivery Time | 15-30 work days |
NAME | AI Embedded PC Board Jetson TX2 Module Development Board Carrier Board NVIDIA For Robot Arm |
Key word | AI Embedded PC Board Jetson TX2 Module Development Board Carrier Board NVIDIA For Robot Arm |
USB3.0 ports (5Gbps bandwidth per port, 1A output current) | 2x USB 3.0 1x Micro USB |
Ethernet | 1x RJ45 |
button | 1x Recovery |
Expand interface | 2x miniPCIE |
Function signal | 2x CAN 4x GPIO 1x I2C |
HDMI 2.0 port (Max 6Gbps, 24bpp, 4096x2160@60Hz) | x1 |
SD card interface | x1 |
fan control interface | x1 |
Weight | 51g |
Board Size | 87mm×60mm×16mm |
Power Supply | +7V~+19V |
Temperature | -20~+65℃ |
Brand Name | PLINK |
Model Number | Y-C1-TX2 |
Place of Origin | China |
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Product Specification
Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | In stock |
Delivery Time | 15-30 work days | NAME | AI Embedded PC Board Jetson TX2 Module Development Board Carrier Board NVIDIA For Robot Arm |
Key word | AI Embedded PC Board Jetson TX2 Module Development Board Carrier Board NVIDIA For Robot Arm | USB3.0 ports (5Gbps bandwidth per port, 1A output current) | 2x USB 3.0 1x Micro USB |
Ethernet | 1x RJ45 | button | 1x Recovery |
Expand interface | 2x miniPCIE | Function signal | 2x CAN 4x GPIO 1x I2C |
HDMI 2.0 port (Max 6Gbps, 24bpp, 4096x2160@60Hz) | x1 | SD card interface | x1 |
fan control interface | x1 | Weight | 51g |
Board Size | 87mm×60mm×16mm | Power Supply | +7V~+19V |
Temperature | -20~+65℃ | Brand Name | PLINK |
Model Number | Y-C1-TX2 | Place of Origin | China |
High Light | Jetson TX2 Embedded PC Board ,TX2 Embedded PC Board ,PC Jetson TX2 module |
AI Embedded PC Board Jetson TX2 Module Development Board Carrier Board NVIDIA For Robot Arm
NVIDIA Development Board Jetson TX2 Module Y-C1-TX2
The Y-C1 is an industrial NVIDIA development board which is suitable for edge AI. based on NVIDIA Jetson TX2 series module, for single board computer, All board devices use wide temperature models.The NVIDIA Jetson TX2 series System-on-Module (SOM) redefines possibility; a combination of performance, power efficiency, integrated deep learning capabilities and rich I/O remove the barriers to a new generation of products. The Jetson TX2 is ideal for many applications including (but not limited to): Intelligent Video Analytics (IVA), Drones, Robotics, Gaming Devices, Virtual Reality (VR), Augmented Reality (AR) and Portable Medical Devices. Superior performance, robust design and reduced complexity in system integration results in more advanced products getting to market faster.Jetson TX2 series modules were designed to be modular from both a functionality standpoint as well as a thermal standpoint. While it integrates several individual components the primary Jetson TX2 series module thermal interface is via a single Thermal Transfer Plate (TTP) that covers the top side. The TTP simplifies thermal design and integration with the system-level thermal solution. See the appropriate version of the Thermal Design Guide for complete details on the thermal evaluation and design process using Jetson TX2 series modules.
NVIDIA Jetson Modules:
TX2: Pascal GPU + ARMv8 + 8GB LPDDR4 + 32GB eMMC + WLAN/BT TX2
4GB: Pascal GPU + ARMv8 + 4GB LPDDR4 + 16GB eMMC
TX2i: Pascal GPU + ARMv8 + 8GB LPDDR4 + 32GB eMMC
Jetson Carrier Board NVIDIA Jetson TX2 module interface
Function | Connect the NVIDIA Jetson TX2 module |
Type/Model | Samtec:SEAM-50-03.5-S-08-2-A-K |
Pound definition | For pin definitions for this connector, refer to the NVIDIA Jetson TX2 Core Module data book for pin definitions |
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Interface | Quality |
USB3.0 | 2 |
SD card | 1 |
UART(3.3V) | 3 |
HDMI 2.0 | 1 |
Debug(3.3V) | 1 |
GPIO(3.3V) | 4 |
RTC battery pin header | 1 |
Type 621 RTC battery holder | 1 |
Gigabit Ethernet (10/100/1000 BASE-T) | 1 |
CAN | 2 |
I2C(3.3V) | 1 |
Fan Control | 1 |
Temperature | -20~+65°C |
Power | +7V~+19V |
Size | 87mm×60mm×16mm |
Weight | 51g |
NVIDIA Jetson TX2 Module Technical Specification
Module | TX2 4G | TX2 8G |
AI Performance | 1.33 TFLOPS | |
GPU | 256-core NVIDIA Pascal™ GPU | |
CPU | Dual-core Denver 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor | |
Memory | 4 GB 128-bit LPDDR4 51.2GB/s | 8 GB 128-bit LPDDR4 59.7GB/s |
Storage | 16 GB eMMC 5.1 | 32 GB eMMC 5.1 |
CSI Camera | Up to 5 cameras (12 via virtual channels) 12 lanes MIPI CSI-2 D-PHY 1.2 (up to 30 Gbps) | Up to 6 cameras (12 via virtual channels) 12 lanes MIPI CSI-2 D-PHY 1.2 (up to 30 Gbps) |
Display | 2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0 2 x4 DSI (1.5Gbps/lane) | |
PCIe | 1 x1 + 1 x4 OR 1 x1 + 1 x1 + 1 x2 (PCIe Gen2) | |
Networking | 10/100/1000 BASE-T Ethernet | 10/100/1000 BASE-T Ethernet, WLAN |
Video Encode | 1x 4K60 (H.265) 3x 4K30 (H.265) 4x 1080p60 (H.265) | |
Video Decode | 2x 4K60 (H.265) 7x 1080p60 (H.265) 14x 1080p30 (H.265) |
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification:
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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