Beijing Plink AI Technology Co., Ltd
| Payment Terms | L/C, D/A, D/P, T/T |
| Supply Ability | 1+set+4weeks |
| Delivery Time | 15-30 work days |
| Packaging Details | 120mm x 120mm x 75mm |
| NAME | 32GB 256 Bit LPDDR5 SBC Embedded System NVIDIA Jetson AGX Orin Develop Kit Vehicle Road Coordination |
| Keyword | 32GB 256 Bit LPDDR5 SBC Embedded System NVIDIA Jetson AGX Orin Develop Kit Vehicle Road Coordination |
| Adaptation core | Jetson AGX Orin |
| AI Performance | 275 TOPS |
| Memory | 32GB 256-bit LPDDR5 204.8GB/s |
| USB Micro-B | USB 2.0 |
| M.2 Key M | x4 PCIe Gen 4 |
| Storage | 64GB eMMC 5.1 |
| Single package size | 120mm x 120mm x 75mm |
| Other I/O | 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
| Brand Name | NVIDIA |
| Model Number | Jetson AGX Orin Developer Kit |
| Place of Origin | USA |
View Detail Information
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | 1+set+4weeks |
| Delivery Time | 15-30 work days | Packaging Details | 120mm x 120mm x 75mm |
| NAME | 32GB 256 Bit LPDDR5 SBC Embedded System NVIDIA Jetson AGX Orin Develop Kit Vehicle Road Coordination | Keyword | 32GB 256 Bit LPDDR5 SBC Embedded System NVIDIA Jetson AGX Orin Develop Kit Vehicle Road Coordination |
| Adaptation core | Jetson AGX Orin | AI Performance | 275 TOPS |
| Memory | 32GB 256-bit LPDDR5 204.8GB/s | USB Micro-B | USB 2.0 |
| M.2 Key M | x4 PCIe Gen 4 | Storage | 64GB eMMC 5.1 |
| Single package size | 120mm x 120mm x 75mm | Other I/O | 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
| Brand Name | NVIDIA | Model Number | Jetson AGX Orin Developer Kit |
| Place of Origin | USA | ||
| High Light | 2GB Jetson SBC Embedded System ，32GB NVIDIA SBC Embedded System ，LPDDR5 nvidia agx developer kit | ||
32GB 256 Bit LPDDR5 SBC Embedded System NVIDIA Jetson AGX Orin Develop Kit Vehicle Road Coordination
NVIDIA Machine Learning Kit (NVIDIA Jetson AGX Orin Developer Kit 32G)
NVIDIA Jetson AGX Orin Developer Kit
A Giant Leap Forward for Robotics and Edge AI Applications
275 TOPS (INT8) + 32GB 256-bit LPDDR5 204.8 GB/s + 64GB eMMC 5.1
NVIDIA Jetson AGX Orin module contains an integrated Ampere GPU composed of 2 Graphic Processing Clusters (GPCs), 8 Texture Processing Clusters (TPCs), 16 Streaming Multiprocessors (SM’s), 192 KB of L1-cache per SM, and 4 MB of L2 Cache. There are 128 CUDA cores per SM for Ampere compared to the 64 CUDA cores for Volta, and four 3rd Generation Tensor Cores per SM. The Orin Ampere GPU provides a total of 2048 CUDA cores and 64 Tensor cores with up to 131 Sparse TOPs of INT8 Tensor compute, and up to 4.096 FP32 TFLOPs of CUDA compute. We have enhanced the tensor cores with a big leap in performance compared to the previous generation. With the Ampere GPU, we bring support for sparsity. Sparsity is a fine-grained compute structure that doubles throughput and reduces memory usage.
Industrial Single Board Computer NVIDIA Jetson AGX Orin Technical Specifications
AI Perf | 275 TOPS (INT8) |
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU |
Max GPU Freq | 1.3 GHz |
CPU Max Freq | 2.2 GHz |
Memory | 32GB 256-bit LPDDR5 |
Storage | 64GB eMMC 5.1 |
DL Accelerator | 2x NVDLA v2.0 |
Vision Accelerator | PVA v2.0 |
Video Encode | 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) |
Video Decode | 1x 8K30 | 3x 4K60 | 6x 4K30 | 12x 1080p60 | 24x 1080p30 (H.265) |
CSI Camera | 16-lane MIPI CSI-2 connector |
Other I/O | 40-pin header (UART, SPI, I2S, I2C, CAN, PWM, DMIC, GPIO) |
Networking | RJ45 connector with up to 10 GbE |
Power | 15W - 60W |
Mechanical | 110mm x 110mm x 71.65mm |
*Virtual Channel related camera information for Jetson AGX Orin is not final and subject to change.
** Refer to the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features
Jetson AGX Orin Developer Kit
Included in the Box
1, Packing Box (including Product manual)
2, NVIDIA Jetson AGX Orin Developer Kit
3, The Power Adaptor
4, The Power Cord (including CE GS/CS BS/FCC UL
5, Type-C to USB interface cable
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification：
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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