Payment Terms | L/C, D/A, D/P, T/T |
Supply Ability | To be discussed |
Delivery Time | 15-30 work days |
NAME | NVIDIA Jetson Orin Nano 4G Module 900-13767-0040-000 Rugged Embedded Computer 20 TOPS |
Keyword | NVIDIA Jetson Orin Nano 4G Module 900-13767-0040-000 Rugged Embedded Computer 20 TOPS |
Module | Jetson Orin Nano 4G |
PN | 900-13767-0040-000 |
Warranty | 3 years |
AI Perf | Up to 20 (Sparse) INT8 TOPs and 10 (Dense) INT8 TOPs |
Memory | 4GB 64-bit LPDDR5 DRAM |
Storage | Supports External Storage (NVMe) |
Operating Requirements | 5W I 10W |
Brand Name | PLink |
Model Number | 7F5 |
Place of Origin | China |
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Product Specification
Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | To be discussed |
Delivery Time | 15-30 work days | NAME | NVIDIA Jetson Orin Nano 4G Module 900-13767-0040-000 Rugged Embedded Computer 20 TOPS |
Keyword | NVIDIA Jetson Orin Nano 4G Module 900-13767-0040-000 Rugged Embedded Computer 20 TOPS | Module | Jetson Orin Nano 4G |
PN | 900-13767-0040-000 | Warranty | 3 years |
AI Perf | Up to 20 (Sparse) INT8 TOPs and 10 (Dense) INT8 TOPs | Memory | 4GB 64-bit LPDDR5 DRAM |
Storage | Supports External Storage (NVMe) | Operating Requirements | 5W I 10W |
Brand Name | PLink | Model Number | 7F5 |
Place of Origin | China | ||
High Light | 5w rugged embedded computer ,20 tops rugged embedded computer ,20 tops rugged embedded systems |
Module | CUDA Cores | Tensor Cores | Operating Frequency per Core (up to) |
Jetson Orin Nano 8GB | 1024 | 32 | 625 MHz |
Jetson Orin Nano 4GB | 512 | 16 | 625 MHz |
Module | CPU Cores | CPU Maximum Frequency |
Jetson Orin Nano 8GB | 6 | 1.5 GHz |
Jetson Orin Nano 4GB | 6 | 1.5 GHz |
AI Perf | Up to 20 (Sparse) INT8 TOPs and 10 (Dense) INT8 TOPs |
Ampere GPU | 512 NVIDIA® CUDA® cores | 16 Tensor cores |
DARM Cortex-A78AE CPU | Six-core (ON 8GB and ON 4GB) Cortex A78AE ARMv8.2 (64-bit) heterogeneous multi-processing (HMP) CPU architecture | 2x clusters (1x 4-core cluster + 128 KB L1 + 256KB L2 per core + 2MB L3) + 1x 2- core cluster (128 KB L1 + 256KB L2 per core + 2MB L3) | System Cache: 4 MB (shared across all clusters) |
Temp. Range | -25°C – 90°C |
Supported Power Input | 5V-20V |
Module Size | 69.6 mm x 45 mm | 260 pin SO-DIMM Connector |
Memory | 4GB 64-bit LPDDR5 DRAM |
Networking | 10/100/1000 BASE-T Ethernet | Media Access Controller (MAC) |
Storage | Supports External Storage (NVMe) |
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification:
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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