Description | Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 19456000 444343 676-BBGA,FCBGA |
Stock | 5000pcs |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Shipping Method | LCL, AIR, FCL, Express |
Model | XCKU035-1FBVA676I |
working temperature | - 40 ℃+100℃ |
Mounting Type | SMT/SMD |
Applications | PCBA |
Shipping | DHL\UPS\Fedex\EMS\HK Post |
Payment | Paypal\TT\Western Union\Trade Assurance |
Sample | Supplied |
Peripherals | DMA, POR, WDT |
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Product Specification
Description | Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 19456000 444343 676-BBGA,FCBGA | Stock | 5000pcs |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Shipping Method | LCL, AIR, FCL, Express |
Model | XCKU035-1FBVA676I | working temperature | - 40 ℃+100℃ |
Mounting Type | SMT/SMD | Applications | PCBA |
Shipping | DHL\UPS\Fedex\EMS\HK Post | Payment | Paypal\TT\Western Union\Trade Assurance |
Sample | Supplied | Peripherals | DMA, POR, WDT |
High Light | XCKU035-1FBVA676I IC ,XCKU035-1FBVA676I FPGA IC ,312 I/O FPGA IC |
XCKU035-1FBVA676I
Products Description:
Xilinx® UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements. Artix® UltraScale+ FPGAs: Highest serial bandwidth and signal compute density in a cost-optimized device for critical networking applications, vision and video processing, and secured connectivity. Kintex® UltraScale FPGAs: High-performance FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost. Kintex UltraScale+™ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of high-performance peripherals and cost-effective system implementation. Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope. Virtex® UltraScale FPGAs: High-capacity, high-performance FPGAs enabled using both monolithic and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance to address key market and application requirements through integration of various system-level functions. Virtex UltraScale+ FPGAs: The highest transceiver bandwidth, highest DSP count, and highest on-chip and in-package memory available in the UltraScale architecture. Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope. Zynq® UltraScale+ MPSoCs: Combine the Arm® v8-based Cortex®-A53 high-performance energy-efficient 64-bit application processor with the Arm Cortex-R5F real-time processor and the UltraScale architecture to create the industry's first programmable MPSoCs. Provide unprecedented power savings, heterogeneous processing, and programmable acceleration. Zynq® UltraScale+ RFSoCs: Combine RF data converter subsystem and forward error correction with industry-leading programmable logic and heterogeneous processing capability. Integrated RF-ADCs, RF-DACs, and soft decision FECs (SD-FEC) provide the key subsystems for multiband, multi-mode cellular radios and cable infrastructure.
Technological Parameters:
Product attributes | Attribute value |
Manufacturer: | Xilinx |
Product type: | FPGA - Field Programmable Gate Array |
Series: | XCKU035 |
Number of logical elements: | 444343 LE |
Adaptive Logic Module - ALM: | 25391 ALM |
Embedded memory: | 19 Mbit |
Number of input/output terminals: | 312 I/O |
Power supply voltage - minimum: | 922 mV |
Power supply voltage - maximum: | 979 mV |
Minimum operating temperature: | - 40 C |
Maximum operating temperature: | + 100 C |
Data rate: | 12.5 Gb/s |
Number of transceivers: | 16 Transceiver |
Installation style: | SMD/SMT |
Packaging/Box: | FBGA-676 |
Trademark: | Xilinx |
Distributed RAM: | 5.9 Mbit |
Embedded Block RAM - EBR: | 19 Mbit |
Humidity sensitivity: | Yes |
Number of logical array blocks - LAB: | 25391 LAB |
Working power supply voltage: | 850 mV |
Product Type: | FPGA - Field Programmable Gate Array |
Factory packaging quantity: | 1 |
Subcategory: | Programmable Logic ICs |
Trademark name: | Kintex UltraScale |
Unit weight: | 95.410 g |
Customer Service:
1. Do you support BOM lists?
Of course, we have a professional team to provide BOM.
2. Shown below. Behind MOQ?
Our MOQ is flexible and can be provided according to your needs, with a minimum of 10 pieces.
3. What about lead time?
After receiving the deposit, we will arrange to pack the goods and contact logistics for delivery. The duration is 3-7 days.
4. Our advantage?
1. Stable and sufficient supply
2. Competitive pricing
3. Rich BOM experience
4. Perfect after-sales service
5. Professional test certificate
5. Our service?
Payment methods :T/T, L/C, D/P, D/A, MoneyGram, Credit Card, paypal, Western Union, Cash, Escrow, Alipay...
6. Transportation:
DHL, TNT, FedEx, EMS, DEPX, Air, Sea Shipping
Product Photos:
Company Details
Business Type:
Distributor/Wholesaler,Agent,Seller
Year Established:
2018
Total Annual:
2000000-400000000
Employee Number:
80~100
Ecer Certification:
Site Member
Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc. We ... Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc. We ...
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