Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability | 5000 Piece/Pieces per Week |
Delivery Time | 1-3 WORKING DAYS |
Packaging Details | standard packing as your request ,ESD/Vacuum/Foam/Cartons |
Description | Spartan®-3A Field Programmable Gate Array (FPGA) IC 144 55296 1584 256-LBGA |
Stock | 5000pcs |
Shipping Method | LCL, AIR, FCL, Express |
Model | XC3S50A-4FTG256C |
working temperature | 0°C ~ 85°C(TJ) |
Mounting Type | SMT/SMD |
Applications | PCBA |
Shipping | DHL\UPS\Fedex\EMS\HK Post |
Payment | Paypal\TT\Western Union\Trade Assurance |
Sample | Supplied |
Packing | Tray Box Reel |
Brand Name | AMD |
Model Number | XC3S50A-4FTG256C |
Certification | SGS.TCT. |
Place of Origin | Original Brand |
View Detail Information
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Product Specification
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Supply Ability | 5000 Piece/Pieces per Week |
Delivery Time | 1-3 WORKING DAYS | Packaging Details | standard packing as your request ,ESD/Vacuum/Foam/Cartons |
Description | Spartan®-3A Field Programmable Gate Array (FPGA) IC 144 55296 1584 256-LBGA | Stock | 5000pcs |
Shipping Method | LCL, AIR, FCL, Express | Model | XC3S50A-4FTG256C |
working temperature | 0°C ~ 85°C(TJ) | Mounting Type | SMT/SMD |
Applications | PCBA | Shipping | DHL\UPS\Fedex\EMS\HK Post |
Payment | Paypal\TT\Western Union\Trade Assurance | Sample | Supplied |
Packing | Tray Box Reel | Brand Name | AMD |
Model Number | XC3S50A-4FTG256C | Certification | SGS.TCT. |
Place of Origin | Original Brand |
XC3S50A-4FTG256C
Products Description:
Very low cost, high-performance logic solution for high-volume, cost-conscious applications • Dual-range VCCAUX supply simplifies 3.3V-only design • Suspend, Hibernate modes reduce system power • Multi-voltage, multi-standard SelectIO™ interface pins • Up to 502 I/O pins or 227 differential signal pairs • LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling • Selectable output drive, up to 24 mA per pin • QUIETIO standard reduces I/O switching noise • Full 3.3V ± 10% compatibility and hot swap compliance • 640+ Mb/s data transfer rate per differential I/O • LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors • Enhanced Double Data Rate (DDR) support • DDR/DDR2 SDRAM support up to 400 Mb/s • Fully compliant 32-/64-bit, 33/66 MHz PCI® technology support • Abundant, flexible logic resources • Densities up to 25,344 logic cells, including optional shift register or distributed RAM support • Efficient wide multiplexers, wide logic • Fast look-ahead carry logic • Enhanced 18 x 18 multipliers with optional pipeline • IEEE 1149.1/1532 JTAG programming/debug port • Hierarchical SelectRAM™ memory architecture • Up to 576 Kbits of fast block RAM with byte write enables for processor applications • Up to 176 Kbits of efficient distributed RAM • Up to eight Digital Clock Managers (DCMs) • Clock skew elimination (delay locked loop) • Frequency synthesis, multiplication, division • High-resolution phase shifting • Wide frequency range (5 MHz to over 320 MHz) • Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing • Configuration interface to industry-standard PROMs • Low-cost, space-saving SPI serial Flash PROM • x8 or x8/x16 BPI parallel NOR Flash PROM • Low-cost Xilinx® Platform Flash with JTAG • Unique Device DNA identifier for design authentication • Load multiple bitstreams under FPGA control • Post-configuration CRC checking • Complete Xilinx ISE® and WebPACK™ development system software support plus Spartan-3A Starter Kit • MicroBlaze™ and PicoBlaze embedded processors • Low-cost QFP and BGA packaging, Pb-free options • Common footprints support easy density migration • Compatible with select Spartan-3AN nonvolatile FPGAs • Compatible with higher density Spartan-3A DSP FPGAs • XA Automotive version available
Technological Parameters:
category | Integrated Circuit (IC) |
manufacturer | AMD |
series | Spartan®-3A |
LAB/CLB | 176 |
Number of logical elements/units | 1584 |
Total RAM bits | 55296 |
I/O count | 144 |
Number of gates | 50000 |
Voltage - Power Supply | 1.14V ~ 1.26V |
Installation type | Surface mount type |
operation temperature | 0°C ~ 85°C(TJ) |
Supplier Device Packaging | 256-FTBGA(17x17) |
Customer Service:
1. Do you support BOM lists?
Of course, we have a professional team to provide BOM.
2. Shown below. Behind MOQ?
Our MOQ is flexible and can be provided according to your needs, with a minimum of 10 pieces.
3. What about lead time?
After receiving the deposit, we will arrange to pack the goods and contact logistics for delivery. The duration is 3-7 days.
4. Our advantage?
1. Stable and sufficient supply
2. Competitive pricing
3. Rich BOM experience
4. Perfect after-sales service
5. Professional test certificate
5. Our service?
Payment methods :T/T, L/C, D/P, D/A, MoneyGram, Credit Card, paypal, Western Union, Cash, Escrow, Alipay...
6. Transportation:
DHL, TNT, FedEx, EMS, DEPX, Air, Sea Shipping
Product Photos:
Company Details
Business Type:
Distributor/Wholesaler,Agent,Seller
Year Established:
2018
Total Annual:
2000000-400000000
Employee Number:
80~100
Ecer Certification:
Site Member
Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc. We ... Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc. We ...
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