Shenzhen Tunsing Plastic Products Co., Ltd.
| Payment Terms | T/T , Western Union, PayPal, L/C |
| Supply Ability | 10000000 Yards / Month |
| Delivery Time | 5-8 work days |
| Packaging Details | 100yard/roll, 1-2roll/CTN |
| Product name | Good Quality Thermoplastic Adhesive Tape For Bank Card Chip Embedding |
| Color | Black |
| Width | 29mm |
| Thickness | 55±5μm |
| Length | 200m |
| Melting Point | 100-120℃ |
| Melt Flow Index | 16±10g/10min ; Condition:ASTMD1238-04 |
| Composition | Polyamide |
| Packing | 100yard/roll, 1-2roll/CTN |
| Application | Thermal packaging of IC card, SIM card, etc |
| Brand Name | Tunsing |
| Model Number | DS-5B |
| Certification | SGS , ISO9001 |
| Place of Origin | China |
View Detail Information
Explore similar products
29mm Width Polyamide Hot Melt Adheseive Tape For Credit Card SIM Card
Hot Melt Adhesive Tape Polyamide Kardel Hb-2 Card Hb-3 Hb-70-1 Card Packaging
Thermoplastic Polyurethane TPU Hot Melt Adhesive Film For Waterproof Fabric
High Stickiness Hot Melt Adhesive Tape Single Sided 1.855mpa For Galvanized C
Product Specification
| Payment Terms | T/T , Western Union, PayPal, L/C | Supply Ability | 10000000 Yards / Month |
| Delivery Time | 5-8 work days | Packaging Details | 100yard/roll, 1-2roll/CTN |
| Product name | Good Quality Thermoplastic Adhesive Tape For Bank Card Chip Embedding | Color | Black |
| Width | 29mm | Thickness | 55±5μm |
| Length | 200m | Melting Point | 100-120℃ |
| Melt Flow Index | 16±10g/10min ; Condition:ASTMD1238-04 | Composition | Polyamide |
| Packing | 100yard/roll, 1-2roll/CTN | Application | Thermal packaging of IC card, SIM card, etc |
| Brand Name | Tunsing | Model Number | DS-5B |
| Certification | SGS , ISO9001 | Place of Origin | China |
| High Light | thermal adhesive tape ，pressure sensitive adhesive tape | ||
Description:
This hot melt adhesive film is applied to the encapsulation of the contact smart card. It has excellent adhesion to PVC, ABS, PC, FR-4 materials. And aim at the damage to chip moudule due to high heat in the card-based laser bar code manufacture process , it can insulate the heat and avoide the thermal damage of module.
This product belongs to modified macromolecular structure type black hot melt adhesive tape. Superior cohesion ensures that there is no structural breakage in the thrust and bending tests after bonding. At the same time, it maintains a balanced bond strength with the chip and the card base.It meets the requirements of ISO7816 for chip encapsulation fastness.
Product Image:
Composition:
Polyamide synthesis modification
Physical Characteristics:
| Color | Black | Release liner | Glassine release paper |
| Density | 1.2±0.02g/cm³ | Conventional Thickness | 55μm |
| Melting point | 100-120℃ | Conventional Width | 29mm |
| Melt Flow Index | 16±10g/10min ; Condition:ASTMD1238-04 | Conventional Length | 200m |
| | | Finished Products Specification | 55um*29MM*200M |
Recommended Bonding Conditions:
| First Lamination: | Second Implanting: |
| Machine Setting: 140℃-160℃ | Machine Setting: 170℃-190℃ |
| Dwell Time: 0.6S-1.2S | Dwell Time: 0.6S-1.2S |
| Pressure: 0.25-0.4mpa | Pressure: 0.25-0.4mpa |
Detailed Images:
Applications:
DS-5B is suitable for thermal encapsulation of IC cards, SIM cards, financial social security cards, and dual interface bank cards.
Certification:
Packing & Delivery :
Packaging Details: 1PC / EAA FILM, 100yard/roll, 2~4roll/CTN, or it's up on the customer's option
Delivery Time: Shipped in 3-5 days after payment by air express.
Our Company:
Shenzhen Tunsing Plastic Products co., Ltd.
Our company was founded in 2007, With ten years of hot melt adhesive development, professional polymer technology team, research and development, production, sales as a whole.
The company has passed ISO9001:2008 enterprise management certification system.
The ISO9001 system control standards are strictly enforced from the production of raw materials to the production of film.
FAQ :
1 .How about hot melt adhesive film?
A: It is just a film, and the basic material is release paper. But the film is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive film have different performances and different usages, we need understand your demands ,then recommend you right products to you.
2.Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years experience. able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us know.
3.How do you transport the products?
If you are not urgent, we usually transport by ship because it is the cheapest way. But for the West Asia area,
we deliver by train because there is no sea to ship. And for samples and urgent cargo, we transport it by air as it is the fastest way .Of course if you have other better idea about transport, we will accept it.
4. May I have your samples?
If you need some sample for reference, please let us know your fully address/ship
mode with courier ,and we will arrange sample for your reference.
5. How long is the lead time?
Sample lead time:3-7 days
Bulk lead time:7-10 days(depends on order quantity)
6. How do I pay for my order?
We accept L/C ,T/T ,Western Union , Paypal , Escrow
Contact Us:
Jessica
Mobile phone ( Whatsapp & Skype ) : 0086 18126266195
Email address: tunsing05@dongshengqy.com
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
500000-6000000
Employee Number:
50~80
Ecer Certification：
Verified Supplier
Shenzhen Tunsing Plastic Products Co.,Ltd. was established in 2007 and is located in the forefront of technology in Shenzhen City, China, covering an area of 10,000 square meters. It has a professional polymer technology team led by Master and PhD engineering. Our company specializes in R&D, pro... Shenzhen Tunsing Plastic Products Co.,Ltd. was established in 2007 and is located in the forefront of technology in Shenzhen City, China, covering an area of 10,000 square meters. It has a professional polymer technology team led by Master and PhD engineering. Our company specializes in R&D, pro...
Get in touch with us
Leave a Message, we will call you back quickly!