HongRuiXing (Hubei) Electronics Co.,Ltd.
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000 square meters per month |
| Delivery Time | 7-10 working days |
| Packaging Details | carton customized |
| Finished | ENIG |
| Material | FR4 |
| SR | green |
| Thickness | 0.13mm |
| Brand Name | Horexs |
| Certification | UL |
| Place of Origin | china |
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Product Specification
| Payment Terms | L/C, D/P, T/T, Western Union, MoneyGram | Supply Ability | 30000 square meters per month |
| Delivery Time | 7-10 working days | Packaging Details | carton customized |
| Finished | ENIG | Material | FR4 |
| SR | green | Thickness | 0.13mm |
| Brand Name | Horexs | Certification | UL |
| Place of Origin | china | ||
| High Light | 0.1mm Rigid Circuit Boards ，SIM Card Rigid Circuit Boards ，ENIG Surface Treatment Rigid Circuit Boards | ||
Description Of IC Substrate pcb
Sim card or Smart card is usually use for bank card ,IoT industry,Smart home electronics,It required lower cost production,and stable quality,long life,ultrhin is the very important on this product.
| Mini.Line space/width | 35/35um - 20/20um - 10/10um |
| Finished Thk. | 0.13mm |
| Raw material | SHENGYI,Mitsubishi,mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others |
| Surface finished | EING/ ENEPIG/ OSP / Soft gold/ Hard gold etc. |
| Copper thickness | 12um |
| Layer | 2 layer |
| Soldermask/PSR | Green Taiyo brand/ AUS 308 / AUS 320 / AUS 410 / SR-1700,300 series |
HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.
HOREXS group has two factories,Old factory located in huizhou city Guangdong,Another one is located in Hubei provice.
HOREXS no set any MOQ / MOV for any clients now.
Yes,We can,Our old factory capacity is 15000sqm/month,New factory is 50000sqm/Month.
Contact person:AKEN,email ID: akenzhang@horexspcb.com,Support roadmap/Design rules files,Production capability files.
No,We dont have it,We are only semiconductor ic substrate manufacture,But we can let our clients to help.
No,From HOREXS roadmap ,HOREXS will start FCBGA substrate manufacture in 2024 or 2025.
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!
Company Details
Business Type:
Manufacturer
Year Established:
2010
Total Annual:
50million-100million
Employee Number:
100~200
Ecer Certification：
Verified Supplier
HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in differen... HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs Electronics (HK) Co.,Ltd(Located in HK),All are just located in differen...
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