Customized Fr4 High Precision Immersion Gold PCB Printed Circuit Board

Customized Fr4 High Precision Immersion Gold PCB printed circuit board Manufacturer

Overview:

PCB Material: Nanya FR4 TG170

Layer of PCB: 8

Surface finish: Immersion gold,ENIG

Copper:3OZ

Size:9*12CM

Name:ROHS high precision immersion gold pcb

FAQ:

1.What service can you provide?

We can provide PCB gerber file design,Copy and Clone,OEM and ODM service.

Not only produce PCB,PCB Assembly,but also Plastic Enclosure,and Complete products

2.Are my design files secure when I send them to you?

Your files are held in complete safety and security while ONESEINE Technology is in possession of them. Your files are never shared nor will any third parties have access to your design files. Since they are your property, we respect the copyright of your files. The customer controls the disposition of these files per your requirements and written approval.

3.For small quantity orders, can you produce prototype PCBs?

Yes. ONESEINE Technology has the capability to produce PCBs in any amount. But,the greater the quantity, the greater the cost savings.

4.Do you have an order minimum?

We accept order with as low as a quantity of 1 (piece or panel).

5.What is the standard thickness of laminate that ONESEINE Technology uses?

1.6 mm (0.063″)

6.What are all your options for laminate thickness?

We can handle the following non-standard thicknesses: 0.2mm (0.0079″), 0.4mm (0.016″), 0.6mm (0.024″), 0.8 mm (0.032″), 1.0 mm (0.04″), 1.2mm (0.047″), 2.0mm (0.079″), and 2.3mm (0.091″).

7.Do you have the capability of manufacturing high frequency materials? Rogers?

While expensive, we can manufacture these materials. Contact us for pricing prior to placing an order.

8.What options exist for the thickness of copper?

0.5 oz, 1.0 oz, 1.5 oz, 2.0 oz, 2.5 oz, 3.0 oz, 3.5 oz, 4.0 oz, 4.5 oz and 5.0 oz.

9.What are the color options for PCB solder masks?

Green, black, blue, red green, yellow and white

10.What are the options for surface finishes?

The options include HASL, Immersion gold, Immersion tin, Immersion Silver, OSP, and HASL lead free. Call for other options.

11.What file formats do you accept for PCB assembly?

Gerber and CAM Auto CAD DXF, DWG formats.

The requirements of high frequency pcb material:

(1) the dielectric constant (Dk) must be very stable

(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.

(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.

(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

What Is FR4 PCB Material?

FR-4 is a high-strength, high-resistant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards (PCBs). The National Electrical Manufacturers Association (NEMA) defines it as a standard for glass-reinforced epoxy laminates.

The FR stands for flame retardant, and the number 4 differentiates this type of laminate from other similar materials. This particular laminate has woven glass-reinforced epoxy resin.

FR-4 PCB refers to the board manufactured with adjacent laminate material. This material is incorporated in double-sided, single-sided, and multi-layered boards.

ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES

High Glass Transition Temperature (Tg) (150Tg or 170Tg)

High Decomposition Temperature (Td) (> 345º C)

Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)

Dielectric Constant (@1 GHz): 4.25-4.55

Dissipation Factor (@ 1 GHz): 0.016

UL rated (94V-0, CTI = 3 minimum)

Compatible with standard and lead-free assembly.

Laminate thickness available from 0.005” to 0.125”

Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”

FR4 PCB Applications:

FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

FR-4 is also used in the construction of relays, switches, standoffs, busbars, washers, arc shields, transformers and screw terminal strips.

Here are some key aspects related to the thermal stability of FR4 PCBs:

The thermal stability of FR4 PCBs refers to their ability to withstand and operate under different temperature conditions without experiencing significant degradation or performance issues.

FR4 PCBs are designed to have good thermal stability, meaning they can handle a wide temperature range without warping, delaminating, or suffering from electrical or mechanical failures.

Glass Transition Temperature (Tg): Tg is an important parameter that characterizes the thermal stability of FR4. It represents the temperature at which the epoxy resin in the FR4 substrate undergoes a transition from a rigid state to a more flexible or rubbery state. FR4 PCBs typically have a Tg value around 130-180°C, which means they can withstand elevated temperatures without significant changes in their mechanical properties.

Coefficient of Thermal Expansion (CTE): CTE is a measure of how much a material expands or contracts with changes in temperature. FR4 PCBs have a relatively low CTE, which ensures that they can withstand thermal cycling without excessive stress or strain on the components and solder joints. The typical CTE range for FR4 is around 12-18 ppm/°C.

Thermal Conductivity: FR4 itself is not highly thermally conductive, which means it is not an excellent heat conductor. However, it still provides adequate heat dissipation for most electronic applications. To enhance the thermal performance of FR4 PCBs, additional measures can be taken, such as incorporating thermal vias or using additional heat sinks or thermal pads in critical areas to improve heat transfer.

Soldering and Reflow Processes: FR4 PCBs are compatible with standard soldering and reflow processes commonly used in electronic assembly. They can withstand the elevated temperatures involved in soldering without significant damage or dimensional changes.

It's important to note that while FR4 PCBs have good thermal stability, they still have limits. Extreme temperature conditions, such as very high temperatures or rapid temperature changes, can potentially cause stress, delamination, or other issues. Therefore, it's important to consider the specific operating environment and choose appropriate materials and design considerations accordingly.

FR4 PCBs are known for their excellent thermal stability, high mechanical strength, and resistance to moisture and chemicals. These properties make them suitable for a wide range of applications, including consumer electronics, telecommunications, automotive, industrial equipment, and more.

The FR4 material consists of a thin layer of copper foil laminated onto a substrate made of woven fiberglass cloth impregnated with epoxy resin. The copper layer is etched to create the desired circuit pattern, and the remaining copper traces provide the electrical connections between components.

The FR4 substrate offers good dimensional stability, which is important for maintaining the integrity of the circuitry over a wide range of temperatures. It also has low electrical conductivity, which helps prevent short circuits between adjacent traces.

In addition to its electrical properties, FR4 has good flame retardant properties due to the presence of halogenated compounds in the epoxy resin. This makes FR4 PCBs suitable for applications where fire safety is a concern.

Overall, FR4 PCBs are widely used in the electronics industry due to their excellent combination of electrical performance, mechanical strength, thermal stability, and flame retardancy.