Standard PCB Thickness 4 Layer Core 0.5m Fr4 Copper Clad Laminate

Standard PCB Thickness 4 Layer Core 0.5m Fr4 Copper Clad Laminate

PCB parameter:

Material:ShengyiFR4

Layers:4

Solder mask:Green

PCB size:9*8CM

Copper:1OZ

Thickness:2.6mm

Surface finish:HASL

1,Standard ONESEINE PCB Thickness

The typical PCB thickness is 0.063inches or 1.57mm; it is a standardized level defined from the past. That is because, during the plywood industry, 0.063" was the thickness of the plywood sheets used as substrates for electronic devices, which included PCBs.

When multiple layer PCBs started developing, the thickness of the connectors between the boards had to match. Therefore, the level of consistency became a significant variable, and there was a requirement for a standard deck of the copper used as layers on the plate edges. In turn, 0.063" became the Standard PCB Thickness.

Nevertheless, there is a broad thickness range of 0.008 inches to 0.240 inches, between which you can choose depending on the application or usage area. It is, therefore, essential that you communicate requirements for the appropriate PCB thickness size.

2,What If I Want a Custom Thickness?

Sheets or panels used for manufacturing PCBs are easily available in the market. There are various customization options that offer designs and thicknesses as per your specifications and needs. You can pick the thickness range from 0.2mm to 6.3mm in millimeter increments of a hundredth. Read further to find out factors that must be supervised while opting for a customised PCB board thickness.

Factors to keep in mind for Custom PCB Thickness

1) Turnaround time: Generally, the expected turnaround time to receive a customized PCB layer thickness is more due to the uncommon thickness specifications. This will impact your delivery schedule and development timing.

2) CM’s equipment capabilities: If you do not want to compromise in your design and model, be careful while choosing your CM. If your CM has limited options of equipment to manufacture and design the typical PCB thickness you are looking for, you will have to compromise and modify your PCB layout.

3) Additional costs: Customization costs are generally higher due to the additional details and expectations. The use of specific material, design, and adhering to a detailed set of instructions amounts to additional manufacturing costs than usual prices.

Using customized thickness can increase the design appeal and yield, providing it an exclusive performance and value. However, using multiple layers can be very costly due to extra processing, manufacturing steps, and materials.

With a perfect manufacturing partner, the desired thickness can be achieved smoothly. The first step to customization is generally determining common core prepreg thickness and combining it in a perfect sequence with copper plating, copper foil, and solder mask.

We, at Absolute Electronics, take care of your needs with high-quality, accurate prototypes. We can cater to all your standard and customization needs with good designs and intent. Few highlights of our Custom PCB Manufacturing Service:

Accurate quote within 24 hours

The entire turnkey process performed within or less than three days

Reduced procurement time

Dedicated and committed Quality Certification

High PCB quality

Automated Optical Inspection

3,Factors That Impact PCB Thickness

While it is important to know industry standard thicknesses, many factors may necessitate a custom board. Depending on these design and manufacturing factors, your board may need to be a non-standard thickness. Two main groups of factors impact PCB thickness — design factors and manufacturing factors. We cover these factors in more detail below and will help you determine how to choose a PCB thickness for your project.

Design Factors That Impact PCB Thickness FROM oneseine

Design factors are considered during the PCB design phase. These factors mostly focus on the functionality and purpose of the board, rather than practical considerations necessitated during manufacture, though manufacturing factors hold equal weight. Some of the most important design factors that impact PCB thickness include the following:

1. Size, Weight and Flexibility

Thinner boards are lighter and more flexible than their thicker counterparts but will break more easily due to brittleness. While flex PCBs must be thin to achieve their flexibility, applications that do not require flexibility may benefit from a slightly thicker board for the sake of structural integrity. However, while thicker boards are more rugged, they also carry more weight and take up more space within a device. Both of these features may pose a problem for lightweight applications or devices with limited spatial capacity. The final application of the PCB determines these factors, which must be some of the first parameters to define before beginning PCB design.

2. Copper Thickness

Copper thickness plays a role in the overall thickness of the PCB. The thickness of the copper layer used usually depends on the current that needs to pass through the PCB. Standard copper thickness is roughly 1.4 to 2.8 mils (1 to 2 oz), but this thickness is adjusted according to the unique requirements of the board. The thicker the copper, the thicker the board and the more expensive the board will be due to material needs and processing challenges.

3. Board Materials

The operation and lifetime of a PCB depend on the choice of materials, but these choices also impact board thickness. Typical board fabrication consists of the substrate, laminate, solder mask and silkscreen. Of these, the laminate and substrate are the most important materials for consideration, as they provide the structure of the board and greatly impact overall thickness. The substrate may consist of paper and epoxy resin, glass weave or ceramic depending on the necessary dielectric constant. Laminates, on the other hand, consist of thermoset resin and either paper or cloth layers. Both laminates and substrates come in many options that determine the thermal, mechanical and electrical properties of a circuit board, but also determine the board’s overall thickness.

What Is FR4 PCB Material?

FR-4 is a high-strength, high-resistant, glass-reinforced epoxy laminate material used to fabricate printed circuit boards (PCBs). The National Electrical Manufacturers Association (NEMA) defines it as a standard for glass-reinforced epoxy laminates.

The FR stands for flame retardant, and the number 4 differentiates this type of laminate from other similar materials. This particular laminate has woven glass-reinforced epoxy resin.

FR-4 PCB refers to the board manufactured with adjacent laminate material. This material is incorporated in double-sided, single-sided, and multi-layered boards.

ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES

High Glass Transition Temperature (Tg) (150Tg or 170Tg)

High Decomposition Temperature (Td) (> 345º C)

Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)

Dielectric Constant (@1 GHz): 4.25-4.55

Dissipation Factor (@ 1 GHz): 0.016

UL rated (94V-0, CTI = 3 minimum)

Compatible with standard and lead-free assembly.

Laminate thickness available from 0.005” to 0.125”

Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”

FR4 PCB Applications:

FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

FR-4 is also used in the construction of relays, switches, standoffs, busbars, washers, arc shields, transformers and screw terminal strips.

Here are some key aspects related to the thermal stability of FR4 PCBs:

The thermal stability of FR4 PCBs refers to their ability to withstand and operate under different temperature conditions without experiencing significant degradation or performance issues.

FR4 PCBs are designed to have good thermal stability, meaning they can handle a wide temperature range without warping, delaminating, or suffering from electrical or mechanical failures.

Glass Transition Temperature (Tg): Tg is an important parameter that characterizes the thermal stability of FR4. It represents the temperature at which the epoxy resin in the FR4 substrate undergoes a transition from a rigid state to a more flexible or rubbery state. FR4 PCBs typically have a Tg value around 130-180°C, which means they can withstand elevated temperatures without significant changes in their mechanical properties.

Coefficient of Thermal Expansion (CTE): CTE is a measure of how much a material expands or contracts with changes in temperature. FR4 PCBs have a relatively low CTE, which ensures that they can withstand thermal cycling without excessive stress or strain on the components and solder joints. The typical CTE range for FR4 is around 12-18 ppm/°C.

Thermal Conductivity: FR4 itself is not highly thermally conductive, which means it is not an excellent heat conductor. However, it still provides adequate heat dissipation for most electronic applications. To enhance the thermal performance of FR4 PCBs, additional measures can be taken, such as incorporating thermal vias or using additional heat sinks or thermal pads in critical areas to improve heat transfer.

Soldering and Reflow Processes: FR4 PCBs are compatible with standard soldering and reflow processes commonly used in electronic assembly. They can withstand the elevated temperatures involved in soldering without significant damage or dimensional changes.

It's important to note that while FR4 PCBs have good thermal stability, they still have limits. Extreme temperature conditions, such as very high temperatures or rapid temperature changes, can potentially cause stress, delamination, or other issues. Therefore, it's important to consider the specific operating environment and choose appropriate materials and design considerations accordingly.

FR4 PCBs are known for their excellent thermal stability, high mechanical strength, and resistance to moisture and chemicals. These properties make them suitable for a wide range of applications, including consumer electronics, telecommunications, automotive, industrial equipment, and more.

The FR4 material consists of a thin layer of copper foil laminated onto a substrate made of woven fiberglass cloth impregnated with epoxy resin. The copper layer is etched to create the desired circuit pattern, and the remaining copper traces provide the electrical connections between components.

The FR4 substrate offers good dimensional stability, which is important for maintaining the integrity of the circuitry over a wide range of temperatures. It also has low electrical conductivity, which helps prevent short circuits between adjacent traces.

In addition to its electrical properties, FR4 has good flame retardant properties due to the presence of halogenated compounds in the epoxy resin. This makes FR4 PCBs suitable for applications where fire safety is a concern.

Overall, FR4 PCBs are widely used in the electronics industry due to their excellent combination of electrical performance, mechanical strength, thermal stability, and flame retardancy.