PTFE High Frequency 2 Layer Black OSP F4B PCB Board

PCB details:

F4B-1/2 is laminated with excellent material according to the requirements of microwave circuit in electrical performance. It is a kind of laminate of microwave PCB due to its excellent electrical performance and higher mechanical strength.
woven glass fabric copper-clad laminates with high permittivity
F4BK-1/2
F4BK-1/2 is laminated by laying up of varnished glass cloth with resin, according to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performance(wider range of dielectric constant).
woven glass fabric copper-clad laminates with high permittivity
F4BM-1/2
F4BM-1/2 is laminated by laying up of varnished glass cloth with resin, according to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performance(wider range of dielectric constant,lower dielectric loss angle tangent,increased resistance,and more stability of performance).
woven glass fabric copper-clad laminates with high permittivity
F4BMX-1/2
F4BMX-1/2 is laminated by laying up of varnished glass cloth with resin, according to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performance(wider range of dielectric constant,lower dielectric loss angle tangent,increased resistance,and more stability of performance).Compared with the F4BM,the consistency of the laminate various properties can be insured through using the imported woven glass fabric.
woven glass fabric copper-clad laminates with high permittivity
F4BME-1/2
F4BME-1/2 is laminated by laying up of the imported varnished glass cloth with resin,according to the scientific formulation and strict technology process. This product takes some advantages over F4BM series in the electrical performance and the passive intermodulation indicators increased.
woven glass fabric copper-clad laminates with ceramic filled
F4BT-1/2
F4BT-1/2 is a micro dispersed ceramic PTFE composite with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. This product have higher dielectric constant than the traditional PTFE copper clad laminates to meet the design and manufacturing of circuit miniaturization. Due to filling with the ceramic powder,F4BT-1/2have a low Z axis coefficient of thermal expansion ensures excellent reliability of plated through-holes. Besides,because of the high thermal conductivity,advantage to the heat dissipation of apparatus.
F4BDZ294
1．Introduction:
F4BDZ294 is a kind of woven glass fabric planar resistor copper-clad laminates with the dielectric constant of 2.94. This kind of high frequency laminates is manufactured by woven glass fabric(with low dielectric constant and low dissipation factor)with the planar resistor copper foil. It features with excellent electrical and mechanical performance. Its high mechanical reliability and excellent electrical stability is suitable for the design of the complicated microwave circuit.
Structure of the material:One side is clad with resistor copper foil,and the other side is clad with traditional copper foil,and the dielectric material with woven glass fabric. The dielectric constant is 2.94.
Features of the material:low dielectric constant and loss；excellent electrical / mechanical performance；lower thermal coefficient of dielectric constant；low outgassing.
2．Application scope
(1)Ground-based and airborne radar system；
(2)Phased array antenna；
(3)GPS antenna；
(4)Power backboard；
(5)Multilayer PCB；
(6)Spotlight network.
Metal base woven glass fabric copper-clad laminates
F4B-1/AL(Cu)
F4B-1/AL(Cu) is a kind of microwave circuit metal base material based on woven glass fabric copper-clad laminates,which is pressed with copper on one side,and aluminum(copper)plate on the other side.
copper-clad laminates
F4T-1/2
F4T-1/2 is a kind of circuit laminate based on the board,which is compressed with electrolytic copper foil(after oxidation treatment)on both sides,and then pressed together after high temperature and high pressure. This product takes some advantages in the electrical performance(low dielectric constant,low dielectric loss angle tangent). It is a good kind of laminate of microwave PCB due to its higher mechanical strength.
Microwave composite dielectric copper-clad substrate
TP-1/2
The advantage of design for microwave circuit using TP-1/2 here:
(1)The dielectric constant is stable and can be optional within the range of 3~16 according to the design of circuit requirement. The operating temperature is  -100℃～+150℃；
(2)The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processing,higher pass-rate of production,and the manufacturing cost is much lower than the ceramic substrate. 
(3)Dissipation factor tgδ≤1×10-3,and the loss has a slight variation with the rise of the frequency.
(4)It is easy for mechanical manufacturing,including drill,punch,grind,cut,etching,etc.. For these,the ceramic substrate cannot be compared.
A special microwave composite dielectric copper-clad substrate
TPH-1/2
TPH-1/2 is made of a new type of inorganic and organic materials,with special  process and compounding.
The advantage of design for microwave circuit using TPH-1/2 here:
(1)The substrate is black. The dielectric constant is 2.65,with consistent performance over broad temperature and frequency ranges. The operating temperature is  -100℃～+150℃；
(2)The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processing,higher pass-rate of production,and the manufacturing cost is much lower than the ceramic substrate. 
(3)Dissipation factor tgδ≤1×10-3,and the loss has a slight variation with the rise of the frequency.
(4)It is easy for mechanical manufacturing,including drill,punch,grind,cut,etching,etc.. For these,the ceramic substrate cannot be compared.
(5) Due to the specific gravity less,the remarkable characteristics of the module are weight lighter manufacturing by this substrate,which but other materials cant compare.
(6)Copper thickness is:0.035μm
ceramic composite dielectric substrate
TF-1/2
TF-1/2 is a kind of circuit laminate based on the (which have excellent microwave and temperature resistance performance)compound with ceramic. This kind of laminate can be comparable with the products(such as RT/duroid 6006/6010/TMM10)from Rogers Corporation in United State of America.
The advantage of design for microwave circuit using TF-1/2 here:
(1)The operating temperature is much higher than TP-series. It is applicable to long-term operation within temperature ranger of -80℃～+200℃,and can be used for wave-welding and melt-back welding.
(2)Used for the manufacturing of the microwave and millimeter wave printed circuit board . 
(3)Better radiation performance,30min20rad/cm2.
(4)Dielectric property is stable and has a slight variation with the rise of temperature and frequency.
woven glass fabric
F4B-N / F4B-J / F4B-T
This product is the raw material for the woven glass fabric copper-clad laminates. Dipping treatment of the resin on the alkali-free woven glass fabric,drying,baking and sintering,the microwave material is formulated. This product is characterized by some features,such as heat-resistance,insulation,low loss,excellent electrical performance,in-adhesion. The woven glass fabric is Widely used in electronics,motor,aviation,textile,chemical and food industry,etc.. In the area of microwave devices,it can be used as the bond film for the manufacturing of multilayer printed circuit board.
1．Type of material
(1)Anti-sticking woven glass fabric:F4B-N ；
(2)Insulation woven glass fabric:F4B-J ；
(3)Ventilated woven glass fabric:F4B-T .

High frequency PCB range:

Frequency Range: High-frequency PCBs are designed to operate in frequency ranges typically starting from a few megahertz (MHz) and extending into the gigahertz (GHz) and terahertz (THz) ranges. These PCBs are commonly used in applications such as wireless communication systems (e.g., cellular networks, Wi-Fi, Bluetooth), radar systems, satellite communication, and high-speed data transmission.

Signal Loss and Dispersion: At high frequencies, signal loss and dispersion become significant concerns. High-frequency PCBs employ techniques to minimize these effects, such as using low-loss dielectric materials, controlled impedance routing, and minimizing the length and number of vias.

PCB Stackup: The stackup configuration of a high-frequency PCB is carefully designed to address signal integrity requirements. It typically consists of multiple layers of copper traces, dielectric materials, and ground planes. The arrangement of these layers is optimized to control impedance, minimize crosstalk, and provide shielding.

RF Connectors: High-frequency PCBs often incorporate specialized RF connectors to ensure proper signal transmission and minimize losses. These connectors are designed to maintain consistent impedance and minimize reflections.

Electromagnetic Compatibility (EMC): High-frequency PCBs must comply with electromagnetic compatibility standards to prevent interference with other electronic devices and to avoid susceptibility to external interference. Proper grounding, shielding, and filtering techniques are employed to address EMC requirements.

Simulation and Analysis: Designing high-frequency PCBs often involves simulation and analysis using specialized software tools. These tools allow designers to assess signal integrity, impedance matching, and electromagnetic behavior before fabrication, helping to optimize the PCB design for high-frequency performance.

Fabrication Challenges: Fabricating high-frequency PCBs can be more challenging compared to standard PCBs. The use of specialized materials, controlled impedance requirements, and tight tolerances require advanced fabrication techniques such as accurate etching, controlled dielectric thickness, and precise drilling and plating processes.

Testing and Validation: High-frequency PCBs undergo rigorous testing and validation to ensure their performance meets the desired specifications. This includes impedance testing, signal integrity analysis, insertion loss measurement, and other RF and microwave tests.

It's important to note that the design and manufacturing of high-frequency PCBs are specialized areas requiring expertise in RF and microwave engineering, PCB layout, and fabrication processes. Working with experienced professionals and consulting relevant design guidelines and standards is crucial to ensure reliable performance at high frequencies.

High frequency PCB description:

 

High-frequency PCB (Printed Circuit Board) refers to a type of PCB that is designed to handle high-frequency signals, typically in the radio frequency (RF) and microwave ranges. These PCBs are engineered to minimize signal loss, maintain signal integrity, and control impedance at high frequencies.

 

Here are some key considerations and features of high-frequency PCBs:

 

Material Selection: High-frequency PCBs often use specialized materials with low dielectric constant (Dk) and low dissipation factor (Df). Common materials include PTFE (Polytetrafluoroethylene), FR-4 with enhanced properties, and specialized laminates like Rogers or Taconic.

 

Controlled Impedance: Maintaining consistent impedance is crucial for high-frequency signals. High-frequency PCBs employ controlled impedance routing, which involves precise trace widths, spacing, and dielectric thickness to achieve the desired characteristic impedance.

 

Signal Integrity: High-frequency signals are susceptible to noise, reflections, and losses. PCB design techniques such as proper ground plane placement, signal return paths, and controlled crosstalk are employed to minimize signal degradation and maintain signal integrity.

 

Transmission Lines: High-frequency PCBs often incorporate transmission lines, such as microstrip or stripline, to carry the high-frequency signals. These transmission lines have specific geometries to control impedance and minimize signal loss.

 

Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.

 

Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.

 

Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.

 

High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.

 

Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.

 

High frequency PCB material in stock:

 

Brand	Model	Thickness(mm)	DK(ER)
Rogers	RO4003C	0.203mm,0.305mm,0.406mm,0.508mm,0.813mm,1.524mm	3.38 ± 0.05
	RO4350B	0.101mm,0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.762mm,1.524mm	3.48 ± 0.05
	RO4360G2	0.203mm,0.305mm,0.406mm,0.508mm,0.610mm,0.813mm,1.524mm	6.15 ± 0.15
	RO4835	0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.591mm, 0.676mm,0.762mm,1.524mm	3.48 ± 0.05
	RT5870	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.33 2.33 ± 0.02
	RT5880	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.20 2.20 ± 0.02
	RO3003	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.00 ±0.04
	RO3010	0.13mm,0.25mm,0.64mm,1.28mm	10.2 ± 0.30
	RO3006	0.13mm,0.25mm,0.64mm,1.28mm	6.15 ± 0.15
	RO3203	0.25mm,0.50mm,0.75mm,1.52mm	3.02±0.04
	RO3210	0.64mm,1.28mm	10.2±0.50
	RO3206	0.64mm,1.28mm	6.15±0.15
	R03035	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.50 ± 0.05
	RT6002	0.127mm,0.254mm,0.508mm,0.762mm,1.524mm,3.048mm	2.94 ± 0.04
	RT6006	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	6.15± 0.15
	RT6010	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	10.2 ± 0.25
TACONIC	TLX-8.TLX-9	0.508. 0.762	2.45-2.65
	TLC-32	0.254,0.508,0.762	3.35
	TLY-5	0.254,0.508.0.8,	2.2
	RF-60A	0.254.0.508.0.762	6.15
	CER-10	0.254.0.508.0.762	10
	RF-30	0.254.0.508.0.762	3
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2