5.8GHZ 2.4GHZ Antenna RF PCB ENIG Circuit Board Manufacturer

Product Specification

5.8GHZ / 24GHZ Antenna Sensor Module RF PCB circuit boards manufacturing

Sensor PCB boards Specification:

Number of layer: 2

Board size: 2.2*2.2cm

Panel size: 30*18cm

Color: Green solder mask black silk screen

Craft edge:yes

Surface finish: Immersion gold

Material: Rogers 4350 0.254mm

Gerber file: required

Name:24GHZ Rogers K-band X-band Rigid Custom PCB Boards for Automatic Door Module

Automatic Door / Sensor Lamp Rigid PCB 2 Layer Control Board With Rogers Material Raw

Sensor PCB information:

The current civilian Doppler microwave sensors are operating in C-band (5.8GHz), X-band (10.525 / 10.687GHz) and K-band (24.125GHz), its transmit power less than 10 mW, are specified in the ITU You do not need to apply for the use of the frequency ISM band. Detection pattern omnidirectional and directional, depending on the antenna gain and transmit power, the detection range of 0.1 to 50 meters.

Microwaves emitted by the transmitting antenna, will be absorbed or reflected by the object is encountered, the power change. If the receiving antenna through the use of the object from the measured object or microwave reflected, and converts it into an electrical signal, and then processed by the measurement circuit, to achieve a microwave detection. Microwave sensors mainly by the microwave oscillator and the microwave antenna. Microwave oscillator is a device for generating microwaves. There are microwave oscillator device comprising klystron, magnetron or some solid elements. An oscillation signal generated by the microwave oscillator required waveguide transmission, and through the antenna out. In order to launch a consistent directional microwave antenna should have a special structure and shape.

PCB Sensor Specifics

At a high level, the capacitive sensor dependencies can be visualized by understanding the basics of a plate capacitor.

First the base capacitance must be accounted for. The term “base capacitance” refers to the measurement result of an “untouched” or uninfluenced sensor element. For simplicity, the base capacitor can be assumed to be constructed from the sensor pad on the topside of the PCB and the ground pour on the bottom side of the PCB.

The PCB itself makes up the “d” in the equation. As mentioned earlier, as d gets smaller (such is the case with flex PCBs), the baseline capacitance increases resulting in reduced sensitivity. The permittivity of free space (ε0) and the material (εr ) define the dielectric constant of the PCB insulator and will affect the ultimate base value. The area of the sensor, “A”, is typically limited to the size of the interacting finger.

Microwave pcb concept:

A microwave PCB, also known as a microwave printed circuit board, is a specialized type of circuit board used in microwave devices and systems. It is designed to handle high-frequency signals and is optimized for microwave applications.

Here are some key points about microwave PCBs:

1. High-Frequency Design: Microwave PCBs are specifically designed to handle high-frequency signals in the microwave range, typically ranging from 300 MHz to several gigahertz (GHz). These boards are engineered to minimize signal loss, maintain controlled impedance, and minimize electromagnetic interference (EMI) at high frequencies.

2. Material Selection: Microwave PCBs are typically made using specialized high-frequency materials that have low dielectric loss and good electrical properties at microwave frequencies. Common substrate materials include ceramic-filled PTFE (Polytetrafluoroethylene), such as Rogers, Taconic, or Arlon, as well as other materials like FR-4 with specific high-frequency characteristics.

3. Controlled Impedance: Maintaining controlled impedance is critical in microwave circuits to ensure signal integrity and minimize reflections. Microwave PCBs utilize controlled impedance traces and transmission lines to match the characteristic impedance of the system, allowing for efficient signal transmission.

4. Design Considerations: Designing a microwave PCB involves careful consideration of various factors, such as trace widths, spacing, via placement, and component placement. High-frequency simulation tools, such as electromagnetic field solvers, are often used to analyze and optimize the design for performance.

5. RF Connectors: Microwave PCBs often incorporate specialized connectors designed for high-frequency applications. These connectors, such as SMA (SubMiniature version A) or SMP (SubMiniature Push-On), provide good RF performance and low signal loss.

6. Grounding and Shielding: Proper grounding and shielding techniques are crucial in microwave PCB design to minimize noise and interference. Ground planes and shielding layers are employed to provide effective isolation and reduce electromagnetic coupling between components and traces.

Microwave PCBs are commonly used in various applications, including microwave communication systems, radar systems, satellite communication systems, wireless networks, and high-frequency test equipment.

It's important to note that designing and manufacturing microwave PCBs require specialized knowledge and expertise due to the unique challenges posed by high-frequency applications. If you are looking to work with microwave PCBs, it's recommended to consult with experienced PCB designers and manufacturers with expertise in high-frequency and microwave design.