Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20unit per package package size:20*15*10cm |
| PCB Standard: | IPC-6012, UL, ISO9001 |
| Service type | PCB Prototype |
| Raw material | EM370(D) |
| Layer count | 12Layer |
| Board Thickness | 0.95mm |
| Stack up | Anylayer |
| Finish treatment | Immersion gold+OSP |
| Line width/space | 50um / 60um |
| Brand Name | TOPCBS |
| Model Number | 0.95mm Anylayer HDI / 12L mainboard |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20unit per package package size:20*15*10cm |
| PCB Standard: | IPC-6012, UL, ISO9001 | Service type | PCB Prototype |
| Raw material | EM370(D) | Layer count | 12Layer |
| Board Thickness | 0.95mm | Stack up | Anylayer |
| Finish treatment | Immersion gold+OSP | Line width/space | 50um / 60um |
| Brand Name | TOPCBS | Model Number | 0.95mm Anylayer HDI / 12L mainboard |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | Any Layer Hdi Pcb Boards 0.95mm ，Hdi Pcb Boards Custom 0.95mm ，hdi circuit boards 0.95mm | ||
0.95mm Anylayer HDI / 12Layer mainboard / EM370D CCL / UFS and OSC area OSP treatment
• IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules (8/95)
• IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Boards (04/03)
• IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvia (06/00)
• IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards (05/99)
• IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials (5/99)
1 . Descriptions:
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.
2 . Specifications:
| Name | 0.95mm Anylayer HDI / 12L mainboard |
| Number of Layers | 12 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM370(D) |
| Thickness | 0.95mm |
| Min Track/Spacing | 50um/60um |
| Min Hole Size | Laser 75um; Drilling size 200um |
| Solder Mask | Blue |
| Silkscreen | White |
| Surface Finish | Immersion gold,OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
3. Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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