Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20units per package box size 20*15*10cm |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | DS7402 and others |
| Finished Copper | 1/3OZ |
| Hole/pad | Laser 100/250um |
| Line width/space | Inn. 100/100um ;Out 95/100um |
| Soldmask | Green |
| Brand Name | TOPCBS |
| Model Number | 8Layer HDI boards for Storage Card boards |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20units per package box size 20*15*10cm |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 | Material | DS7402 and others |
| Finished Copper | 1/3OZ | Hole/pad | Laser 100/250um |
| Line width/space | Inn. 100/100um ;Out 95/100um | Soldmask | Green |
| Brand Name | TOPCBS | Model Number | 8Layer HDI boards for Storage Card boards |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | 1/3OZ Hard Disk SSD PCBs Board ，1/3OZ SSD PCB Board DS7402 8 Layer ，1/3OZ SSD PCB solid state circuit board | ||
DS7402 8 Layer HDI boards Immersion gold surface for Storage Card boards
HDI boards are one of the fastest growing PCB technologies. These contain blind and/or buried vias and often contain micro-vias which are 0.006 or less in diameter. Moreover HDI boards consist of high circuit density compare to traditional circuit boards.
HDI technology leads to space reduction, line reduction, via diameter reduction, BGA pitch reduction, pre-preg thickness reduction, board thickness reduction etc. Moreover HDI PCB supports about 4 to 24 number of layers. PCB thickness in the range from 0.4 to 2.8 mm are supported. Minimum track/gap of about 65/65 µm are supported.
1. Product application
Storage card (SSD) High Density Interconnection (HDI) products can be used in electronic computing and storage devices.
- Convert M.2 NGFF PCIe based SSD to work in main board PCIe x4 bus slot.
- Movable M.2 NGFF stand-offs and multiple plated-holes supports 2280, 2260, 2242 and 2230 SSDs.
- M.2 PCIe SSD gets power from motherboard PCIe bus slot 3.3V.
- Supports industrial operating temperature range: -40 - 85 ºC.
- Motherboard Requirement :An empty PCIe 3.0 or PCIe 2.0 x4, x8, or x16 slot, supports PCIe 2.0 and PCIe 3.0 motherboard.
- Custom pcb board hytepro oem/odm circuit board.
2 . Specifications:
| Name | 8Layer HDI for Storage Card boards |
| Layer | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | DS7402 |
| Min Track/Spacing | 75um/100um |
| Drilling Size | 100um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1/3OZ |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
1: We have a high-quality, professional, honest and positive core team. Team members have rich experience in SMT, wave soldering, testing tooling and fixtures. The company has clearly established quality, production, engineering, procurement, warehousing and other departments, and strictly implements the ISO9001 system to ensure orderly production and high quality! 2: We pay more attention to customer needs and product requirements, and pay more attention to product quality and continuous improvement. Customer first is our eternal purpose. The team members have extensive experience in the resource integration of component procurement. We are enterprising, we work hard, we continue to learn, continue to improve, absorb the strengths of others, and make our team more perfect.
What can we do for you?
1) We can offer sample .
2) Competitive Price( Factory direct price).
3) On time delivery.
4) Good customers service.
5) Professional Technology.
6) Quality Control through the whole Manufacturing process.
a. Check the material before the production.
b. Have the random inspection during the production.
c. Make the 100% inspection before the shipment.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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