Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20unit per package package size:20*15*10cm |
| Name | 1.0mm thermal bar board / 12 Anylayer HDI / Optical module board |
| Drilling Size | 200um |
| Raw material | EM528K |
| Layer count | 12Layer |
| Board Thickness | 1.0mm |
| Stack up | Anylayer |
| Testing Service: | Fly-probe,100% AOI testing, 100% ET testing,100% FQC |
| Line width/space | 50um / 60um |
| Brand Name | TOPCBS |
| Model Number | 1.0mm thermal bar 12 Anylayer HDI / Optical module board |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20unit per package package size:20*15*10cm |
| Name | 1.0mm thermal bar board / 12 Anylayer HDI / Optical module board | Drilling Size | 200um |
| Raw material | EM528K | Layer count | 12Layer |
| Board Thickness | 1.0mm | Stack up | Anylayer |
| Testing Service: | Fly-probe,100% AOI testing, 100% ET testing,100% FQC | Line width/space | 50um / 60um |
| Brand Name | TOPCBS | Model Number | 1.0mm thermal bar 12 Anylayer HDI / Optical module board |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | EM528K HDI PCB ，Interconnect HDI PCB ，12um hdi multilayer pcb | ||
OEM Making machine circuit board aluminum plain copper clad Flexible HDI SMT Assemble
HLD is an industrial grade IOT control board for wired communication. The main board uses the wired network to communicate with the cloud platform, and the switching analog of relay on the main board, AD simulated data collection, IC card data collection, UHF label card data collection, and 5V/12V power supply can be controlled by using this main board.
Its W5500 chip enables users to connect to the Internet in their applications by using a single chip(TCP/IP Stack, 10/100 Ethernet MAC, and PHY embedded). It also has three RS232 ports to fulfill the need for communication peripherals via serial ports.
The following files are required for PCB design:
1: DSN/SCH format Schematic diagram
2: PCB footprint
3: Package library file/main devices datasheet
4: Outline structure drawing/DXF format/DWG format
5:Layout/wiring/timing/frequency/speed/current and other electrical design requirements
6: Reference board/PCB or BRD format
2 . Specifications:
| Min.Hole Size | 0.25mm | |||
| Min.Line Spacing | 0.003" | |||
| Color | Green or as your request | |||
| Material | FR-4 | |||
| Layer Number | 2 Layers | |||
| MOQ | 5pcs | |||
| Board Thickness | 1.6mm | |||
| Surface Finishing | HASL Lead Free | |||
| ODM | Yes | |||
| Package | vaccum package | |||
3. Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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