Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20unit per package package size:20*15*10cm |
| Name | DDR Socket PCB |
| Layer count | 10Layer |
| Board Thickness | 2.0mm |
| Vias | Blind vias，Buried vias,Fill Cu vias |
| Stack up | 10L anylayer ,4-2-4 |
| Finish treatment | Immersion gold |
| Unit size | 23.6*23.6mm(L*W) |
| Pitch size | 0.5P,0.4P,0.35P,0.3P |
| Surface treatment | Immersion gold |
| Brand Name | TOPCBS |
| Model Number | DDR Socket PCB |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20unit per package package size:20*15*10cm |
| Name | DDR Socket PCB | Layer count | 10Layer |
| Board Thickness | 2.0mm | Vias | Blind vias，Buried vias,Fill Cu vias |
| Stack up | 10L anylayer ,4-2-4 | Finish treatment | Immersion gold |
| Unit size | 23.6*23.6mm(L*W) | Pitch size | 0.5P,0.4P,0.35P,0.3P |
| Surface treatment | Immersion gold | Brand Name | TOPCBS |
| Model Number | DDR Socket PCB | Certification | UL94V0 |
| Place of Origin | Suzhou China | ||
| High Light | low power double data rate 4 lpddr4 pcb ，lpddr4 pcb material Lead Free ，ddr4 pcb layers | ||
2.0mm DDR3,DDR4,LPDDR5 Socket Interposer PCBs,4-2-4 Layer stack up
The Advancements in PCB Architecture with the Implementation of DDR4
As previously stated, the landscape in the field of computer technology is in constant flux. With the onset of new standards comes the need for a change in device architecture. That statement is equally true when addressing the generational standards change from DDR3 to DDR4.
These advancements in random access memories also bring about a significant increase in overall performance. Therefore, to be able to utilize the newest RAM requires changes in PCB design. Just as it did when the standard for USB advanced from USB 2.0 to USB 3.0. These types of changes are continuous and necessary as the demand for more processing power, better performance, and higher levels of functionality, continue to drive the advancement of the industry.
Although most people will not notice or see the needed architectural changes required by PCB designs, it does not diminish the importance of these critical changes.
2 . Specifications:
| Name | 2.0mm DDR3,DDR4 interposer PCBs |
| Number of Layers | 4-2-4 Layers |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | Lead Free materials |
| Thickness | 2.0mm |
| Min Track/Spacing | 3/3mil |
| Min Hole Size | 0.075mm laser drilling |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1OZ |
| Lead time | 28-35 days |
| Quick turn service | Yes |
What is the PCB Layout Changes Needed for DDR4 Implementation?
DDR4 or Double Data Rate 4 comes in two distinct module types. So-DIMM or small outline dual in-line memory modules (260-pins) that are in use in portable computing devices like laptops. The other module type is DIMM or dual in-line memory modules (288-pins) that are in use in devices like desktops and servers.
So, the first change in architecture is, of course, due to the pin count. The previous iteration (DDR3) uses 240-pins for a DIMM and 204-pins for a So-DIMM. Whereas the previously mentioned, DDR4 uses 288-pins for its DIMM application. With the increase in pins or contacts, DDR4 offers higher DIMM capacities, enhanced data integrity, faster download speed, and an increase in power efficiency.
Accompanying this overall improvement in performance is also a curved design (bottom) that enables better, more secure attachment, and it improves stability and strength during installation. Also, there are bench tests that confirm that DDR4 offers a 50% increase in performance and can achieve up to 3,200 MTs (Mega Transfers per Second).
Furthermore, it achieves these increases in performance in spite of using less power; 1.2 volts (per DIMM) instead of the 1.5 to 1.35-volt requirement of its predecessor. All of these changes mean that the PCB designers must reassess their design approach for the implementation of DDR4.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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