Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20units per package box size 20*15*10cm |
| Supplier Type: | HDI Pcb Pcba |
| Number of layers: | 1-48 |
| Material | EM370 |
| Line width/space | 50um/50um |
| Soldermask | Black |
| Laser size | 75um |
| Brand Name | TOPCBS |
| Model Number | Mobile Phone motherboard |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20units per package box size 20*15*10cm |
| Supplier Type: | HDI Pcb Pcba | Number of layers: | 1-48 |
| Material | EM370 | Line width/space | 50um/50um |
| Soldermask | Black | Laser size | 75um |
| Brand Name | TOPCBS | Model Number | Mobile Phone motherboard |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | 5g ethernet port motherboard ，5g aau pcb ，5g ethernet motherboard | ||
One-Stop Service 5G Pcba Design Assembly Flex Pcb
With the penetration of 5G technology, electric products like smart phone, tablet PC, smart watch, etc. become more intelligent, much smaller-sized with higher frequency, higher speed and higher level integration. What’s more, number of components assembled on PCB also rises a lot. In the meanwhile, with the development of high-frequency, high-speed transmission and multi-function of 5G products, screen is required to be larger, resolution be better and power consumption be improved. However, currently there’s no breakthrough in battery technology, which means main board space has to be compressed.
1. Product application
Any layer of interconnect board products can be applied to mobile communication terminals, which integrates a variety of circuits, enabling mobile terminals to handle complex tasks and have rich communication methods. With the development of communication technologies, mobile terminals have become modern Internet services. The main platform.
2 . Specifications:
| Name | 10Layer anylayer HDI PCB for 5G mobile phone motherboard |
| Layer | 10 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM370 |
| Min Track/Spacing | 75um/100um |
| Drilling Size | 100um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold |
| Finished Copper | 1/3OZ |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
PCBs for high frequency applications require to be subjected to automatic inspection procedures, both optical (AOI) or performed through ATE. These procedures allow to enormously increase the quality of the product, highlighting possible errors or inefficiencies of the circuit. The recent progress made in the field of automatic inspection and testing of PCBs has led to significant time savings and reduced costs associated with manual verification and testing. The use of new automated inspection techniques will help overcome the challenges imposed by 5G, including global impedance control in high frequency systems. Increased adoption of automated inspection methods also allows for consistent performance with high production rates.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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