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China factory - Topmatch Electronics (Suzhou) Co., Limited.

Topmatch Electronics (Suzhou) Co., Limited.

  • China,Suzhou ,Jiangsu
  • Active Member

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China UL94V0 8 Layer SSD PCB Board Solid State Drive HDI Boards Storage Card
China UL94V0 8 Layer SSD PCB Board Solid State Drive HDI Boards Storage Card

  1. China UL94V0 8 Layer SSD PCB Board Solid State Drive HDI Boards Storage Card

UL94V0 8 Layer SSD PCB Board Solid State Drive HDI Boards Storage Card

  1. MOQ: Negotiation
  2. Price: Negotiation
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Payment Terms T/T
Supply Ability 10000unit per month
Delivery Time 10-14working days
Packaging Details 20units per package box size 20*15*10cm
Layer 8
Material DS7402 and others
Thickness 1.0mm
Hole/pad Laser 100/250um
Surface Finish Immersion gold
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Brand Name TOPCBS
Model Number 8Layer HDI boards for Storage Card boards
Certification UL94V0
Place of Origin Suzhou China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 10000unit per month
Delivery Time 10-14working days Packaging Details 20units per package box size 20*15*10cm
Layer 8 Material DS7402 and others
Thickness 1.0mm Hole/pad Laser 100/250um
Surface Finish Immersion gold Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Brand Name TOPCBS Model Number 8Layer HDI boards for Storage Card boards
Certification UL94V0 Place of Origin Suzhou China
High Light UL94V0 8 Layer SSD PCB BoardUL94V0 SSD PCB Board solid state driveUL94V0 pcb ssd

UL94V0 8 Layer HDI boards 1.0mm thickness for Storage Card boards

 

 

  1. Through-Hole Vias – It is a hole pierced using a drill or laser through the PCB from top to bottom connecting all the layers of the multi-layer PCB. The Through-hole PCB is easy to construct and are the most cost-effective type of vias. The Through holes are further divided into Plated Through (with copper pads) Holes and Non-Plated Through Holes (without copper pads).
  2. Blind Vias – A type of via where a hole is pierced using a drill or laser to connect the external layer of multi-layer HDI PCB to the internal layer. Since the hole is visible only on one side of the PCB board, it is called Blind via. This type of via is difficult to construct and are expensive.
  3. Buried Vias – A via that connects two internal layers of multi-layer HDI PCB. This via is always inside the printed circuit board and are not visible from the outside. Therefore, it is called buried via. The buried via is also an electroplated hole that needs a separate drill file. The layer count in a buried via is even in number i.e., 2, 4, 6, and on.
  4. Microvias – It is the smallest vias or holes with a diameter less than 150 microns, drilled using a laser. Microvias are most commonly implemented in HDI PCBs, usually to connect one layer of the PCB to its adjacent layer and have a very small diameter in comparison to the mechanically drilled vias such as through-hole. Due to their size and ability to connect one layer to an adjacent layer, they enable denser printed circuit boards with more complex designs.
Name 8Layer HDI for Storage Card boards
Layer 8
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material DS7402
Min Track/Spacing 75um/100um
Drilling Size 100um
Solder Mask Green
Silkscreen White
Surface Finish Immersion gold
Finished Copper 1/3OZ
Production time 10-21 working days
Lead time 2-3 days
  • The solder joint defect rate is low, the high frequency characteristic is good, and the electromagnetic and radio frequency interference are reduced. High precision and high practicability.
  • It is easy to realize automation, improve production efficiency, and reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.
  • The assembly density is high, the electronic products are small in size, and the weight is light. The volume and weight of the patch components are only about 1/10 of the traditional plug-in components.
  • After SMT is generally adopted, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. High reliability and strong anti-vibration ability.

 

1. Product application

 

Storage card (SSD) High Density Interconnection (HDI) products can be used in electronic computing and storage devices.

 

- Convert M.2 NGFF PCIe based SSD to work in main board PCIe x4 bus slot.
- Movable M.2 NGFF stand-offs and multiple plated-holes supports 2280, 2260, 2242 and 2230 SSDs.
- M.2 PCIe SSD gets power from motherboard PCIe bus slot 3.3V.
- Supports industrial operating temperature range: -40 - 85 ºC.
- Motherboard Requirement :An empty PCIe 3.0 or PCIe 2.0 x4, x8, or x16 slot, supports PCIe 2.0 and PCIe 3.0 motherboard.
- Custom pcb board hytepro oem/odm circuit board.

 

 

 

1: We have a high-quality, professional, honest and positive core team. Team members have rich experience in SMT, wave soldering, testing tooling and fixtures. The company has clearly established quality, production, engineering, procurement, warehousing and other departments, and strictly implements the ISO9001 system to ensure orderly production and high quality! 2: We pay more attention to customer needs and product requirements, and pay more attention to product quality and continuous improvement. Customer first is our eternal purpose. The team members have extensive experience in the resource integration of component procurement. We are enterprising, we work hard, we continue to learn, continue to improve, absorb the strengths of others, and make our team more perfect.

 

 

What can we do for you?
1) We can offer sample .
2) Competitive Price( Factory direct price).
3) On time delivery.
4) Good customers service.
5) Professional Technology.
6) Quality Control through the whole Manufacturing process.
a. Check the material before the production.
b. Have the random inspection during the production.

c. Make the 100% inspection before the shipment.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    1999

  • Total Annual:

    400 million-600 million

  • Employee Number:

    500~1000

  • Ecer Certification:

    Active Member

Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.     Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI  and other special boards with competitive cost.    

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Get in touch with us

  • Reach Us
  • Topmatch Electronics (Suzhou) Co., Limited.
  • Room 301, Building 1, Shahu Science and Technology Park, SIP, SUZHOU City,Jiangsu Province,P.R.C
  • https://www.hdi-pcbs.com/

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