Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20unit per package package size:20*15*10cm |
| Name | 1.0mm flexible 12 Anylayer HDI / Optical module board |
| Usage | OEM Electronics |
| Raw material | EM528K |
| Layer count | 12Layer |
| Board Thickness | 1.0mm |
| Min. Line Spacing: | 4mil |
| Finish treatment | ENEPIG |
| Line width/space | 50um / 60um |
| Brand Name | TOPCBS |
| Model Number | 1.0mm flexible 12 Anylayer HDI / Optical module board |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
View Detail Information
Explore similar products
Any Layer Hdi Pcb Board Custom Em 370 Pcb Material CCL UFS OSC OSP 0.95mm
Ipc Type 3 Hdi Prototype Pcb Board Manufacturer 0.2mm-4mm
High Density Interconnect Hdi Pcb Supplier 12 Layer Hdi Multilayer Pcb Board 0
1oz Hdi Pcb Design Hdi Board Technology Construction High Density Interconnect
Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20unit per package package size:20*15*10cm |
| Name | 1.0mm flexible 12 Anylayer HDI / Optical module board | Usage | OEM Electronics |
| Raw material | EM528K | Layer count | 12Layer |
| Board Thickness | 1.0mm | Min. Line Spacing: | 4mil |
| Finish treatment | ENEPIG | Line width/space | 50um / 60um |
| Brand Name | TOPCBS | Model Number | 1.0mm flexible 12 Anylayer HDI / Optical module board |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | Fpc Hdi High Density Interconnect EM528K ，interconnect pcb ，hdi pcb fabrication process | ||
1.0mm flexible board / 12Layer Anylayer HDI / Optical module Board / EM528K CCL / ENEPIG treatment
Over the course of a decade in business, PCBCart has established a hard-earned reputation for manufacturing PCBs of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at competitive prices without min order quantity requirement. Our team run design for manufacture check on your custom PCB file and consult with you to ensure it is ready for manufacturing and that your boards will meet your performance requirements. We also have an on-site quality control department to verify the finished product meet your high quality standards.
1 . Descriptions:
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.
2 . Specifications:
| Name | 1.0mm flexible 12 Anylayer HDI / Optical module board |
| Number of Layers | 12 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | EM528K |
| Thickness | 1.0mm |
| Min Track/Spacing | 50um/60um |
| Min Hole Size | Laser 75um; Drilling size 200um |
| Solder Mask | Blue |
| Silkscreen | White |
| Surface Finish | ENEPIG |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
3. Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
Get in touch with us
Leave a Message, we will call you back quickly!