Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20units per package box size 20*15*10cm |
| Layer count | 8Layer |
| Raw material | IT180A |
| Finished Treatment | Immerion Gold + OSP |
| Pitch Size | 0.25mm |
| Board thickness | 0.8mm |
| Line width/space | 75um/100um |
| Brand Name | TOPCBS |
| Model Number | BIB and test Boards |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20units per package box size 20*15*10cm |
| Layer count | 8Layer | Raw material | IT180A |
| Finished Treatment | Immerion Gold + OSP | Pitch Size | 0.25mm |
| Board thickness | 0.8mm | Line width/space | 75um/100um |
| Brand Name | TOPCBS | Model Number | BIB and test Boards |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | Burn In Circuit Board Hdi 0.25pitch ，Hdi Circuit Boards 0.25pitch ，0.25pitch burn in board manufacturer | ||
0.25pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board
Burn-in is the testing of a PCB to detect early failures and establish load capacity. This is often done by running a power supply and firmware through the electronics for 12 to 48 hours. This testing process is intended to outline possible defects by running products at elevated voltage levels, outside standard temperature ranges, and under power cycling conditions.
The burn-in process enables the detection of components that will fail not only because of a specific physical defect but also because of a more general failure that occurred during assembly. The motive is to identify and replace failed components during the initial phase of the burn-in testing.
1 . Descriptions:
What is a BIB ?
A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.
2 . Specifications:
| Name | 0.25pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards |
| Number of Layers | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | IT180 |
| Thickness | 0.8mm |
| Min Track/Spacing | 75um/75um |
| Min Hole Size | Laser 75um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold + OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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