Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20units per package box size 20*15*10cm |
| Layer count | 8Layer |
| Raw material | IT180A |
| Finished Treatment | Immerion Gold + OSP |
| Pitch Size | 0.35mm |
| Board thickness | 0.8mm |
| Line width/space | 75um/100um |
| Brand Name | TOPCBS |
| Model Number | BIB and test Boards |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20units per package box size 20*15*10cm |
| Layer count | 8Layer | Raw material | IT180A |
| Finished Treatment | Immerion Gold + OSP | Pitch Size | 0.35mm |
| Board thickness | 0.8mm | Line width/space | 75um/100um |
| Brand Name | TOPCBS | Model Number | BIB and test Boards |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | 0.35mm Pitch Hdi Printed Circuit Boards ，0.35mm Hdi Printed Circuit Boards Burn In Testing ，0.35mm Semiconductor test board | ||
0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board
Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to withstand the hot temperatures during tests.
Burn in boards utilize high grade materials. For testing up to 125C a special version of FR4 is used (High Tg FR4). For higher temperatures up to 250C a Polyimide is used; and for very high temperatures up to 300C a High grade polyimide is used.
1 . Descriptions:
What is a BIB ?
A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.
2 . Specifications:
| Name | 0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards |
| Number of Layers | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | IT180 |
| Thickness | 0.8mm |
| Min Track/Spacing | 75um/75um |
| Min Hole Size | Laser 75um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold + OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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