Topmatch Electronics (Suzhou) Co., Limited.
| Payment Terms | T/T |
| Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days |
| Packaging Details | 20units per package box size 20*15*10cm |
| Layer count | 8Layer |
| Raw material | IT180A |
| Finished Treatment | Immerion Gold + OSP |
| Pitch Size | 0.3mm |
| Board thickness | 0.8mm |
| Line width/space | 75um/100um |
| Brand Name | TOPCBS |
| Model Number | BIB and test Boards |
| Certification | UL94V0 |
| Place of Origin | Suzhou China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10000unit per month |
| Delivery Time | 10-14working days | Packaging Details | 20units per package box size 20*15*10cm |
| Layer count | 8Layer | Raw material | IT180A |
| Finished Treatment | Immerion Gold + OSP | Pitch Size | 0.3mm |
| Board thickness | 0.8mm | Line width/space | 75um/100um |
| Brand Name | TOPCBS | Model Number | BIB and test Boards |
| Certification | UL94V0 | Place of Origin | Suzhou China |
| High Light | Semiconductor Burn In Test Pcb Board ，Burn In Test Pcb Board Fabrication Process ，Burn-In Testing | ||
0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board
A burn-in board is a printed circuit board that is used in the burn-in process.
The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.
During the burn-in process extreme temperatures often ranging from 125°C – 250°C or even 300°C are applied so the materials used need to be extremely durable. Generally speaking we use IS410 for applications up to 155°C and polyimide for applications up to 250°C. For temperatures over 250°C a higher grade of polyimide is used. We also use high temperature lead free solders and stainless-steel board fixtures.
1 . Descriptions:
What is a BIB ?
A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.
2 . Specifications:
| Name | 0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards |
| Number of Layers | 8 |
| Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
| Material | IT180 |
| Thickness | 0.8mm |
| Min Track/Spacing | 75um/75um |
| Min Hole Size | Laser 75um |
| Solder Mask | Green |
| Silkscreen | White |
| Surface Finish | Immersion gold + OSP |
| Finished Copper | 12um |
| Production time | 10-21 working days |
| Lead time | 2-3 days |
Company Details
Business Type:
Manufacturer
Year Established:
1999
Total Annual:
400 million-600 million
Employee Number:
500~1000
Ecer Certification：
Active Member
Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost. Our PCBs facility is located at East China, closed to Shanghai City. We delivery our technology in High Layer Count、Rigidflex 、HDI and other special boards with competitive cost.
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