XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
| Payment Terms | T/T |
| Supply Ability | 10,000 wafers/month |
| Delivery Time | 5-50 working days |
| product name | 4 inch Silicon Wafer |
| brand | powerway |
| feature | Double Side Lapping |
| Conductance type | N Type |
| Thickness | 205-220μm |
| size | 4 inch |
| Brand Name | PAM-XIAMEN |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10,000 wafers/month |
| Delivery Time | 5-50 working days | product name | 4 inch Silicon Wafer |
| brand | powerway | feature | Double Side Lapping |
| Conductance type | N Type | Thickness | 205-220μm |
| size | 4 inch | Brand Name | PAM-XIAMEN |
| Place of Origin | China | ||
| High Light | float zone wafer ，epitaxial silicon wafer | ||
4 Inch Silicon Wafer CZ N Type Phosphorus Doped Orientation 111 Prime Grade 4" Double Side Lapping
PAM-XIAMEN is a manufacturer of CZ and FZ silicon wafer, we now become the worldwide source for high pure silicon wafers,thermal oxide silicon and epi wafers. Silicon wafer is used for integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and solar cells and finally apply to computer, mobile, sensor and other electronics. With rich experiences , PAM-XIAMEN understand your requirements and can provide exactly the silicon products you need with the suitable quality and lowest possible price . PAM-XIAMEN can provide both standard and customized silicon wafers to meet your demands.PAM-XIAMEN offer semiconductor silicon wafer with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon wafers. The polishing process is also made according to SEMI standard( the Semiconductor Equipment and Materials International standards). We also work ultra thin wafer, silicon oxide wafer SiO2 thin film, silicon nitride wafer Si3N4 thin film, thin film deposition and metallization on silicon wafers.
4inch Silicon Wafer CZ N Type Phosphorus Doped Orientation 111 Prime Grade 4" Double Side Lapping
| Type | Conduction Type | Orientation | Diameter(mm) | Resistivity(Ω•cm) |
| CZ | N&P | <100><110>&<111> | 50-300 | 1-300 |
| MCZ | N&P | <100><110>&<111> | 50-300 | 1-300 |
| Heavy-doping | N&P | <100><110>&<111> | 50-300 | 0.001-1 |
| Parameter | Unit | Value |
| Crystalline structure | - | Monocrystalline |
| Growth technique | - | CZ |
| Crystal Orientation | - | 111 |
| Conductance type | - | N |
| Dopant | - | Phosphorus |
| Diameter | mm | 100 |
| Resistivity | Ωcm | 12-15 |
| Thickness | um | 205-220μm |
| TTV | um | - |
| BOW | um | - |
| Warp | um | - |
| (G)STIR | um | Customer standard |
| Site Flatness-STIR | um | Customer standard |
| Edge Exclusion Zone | mm | SEMI STD or Customer Request |
| LPD's | - | - |
| Oxygen Concentration | ppma | - |
| Carbon Concentration | ppma | - |
| RRG | - | - |
| Front Surface | - | Lapping |
| Back Surface | - | Lapping |
| Edge Surface Condition | SEMI STD or Customer Request | |
| Primary Flat Length | mm | 32.5±2.5mm |
| Primary Flat Orientation(100/111) & Angle(°) | - | |
| Secondary Flat Length | mm | - |
| Secondary Flat Orientation(100/111) & Angle(°) | - | |
| Laser mark | - | SEMI STD or Customer Request |
| Packaging | Packaged in a class 100 clean room environment, Heat-sealed plastic inner/aluminium foil outer bags, Vacuum Packing |
|
| If specific requirement by customer, will adjust accordingly | ||
What is a Silicon Wafer?
Silicon wafer is the most common semiconductor and the most widely used in the electronic and technology sector, which is a key component in integrated circuits, during the growth process intentional additions of dopants can be added to the to change the purity of the silicon depending on what the purpose of it will be, boron, aluminum, nitrogen, gallium and indium are common silicon dopants. Depending on what level the silicon has been doped, the semiconductor can be considered extrinsic or degenerate. Extrinsic would be lightly to moderately doped whereas degenerate semiconductors act more as conductors because of the high levels of doping that occurs during the fabrication.
PAM-XIAMEN can offer you technology and wafer support, for more information, please visit our website: https://www.powerwaywafer.com,
send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com
Quality is our first priority. PAM-XIAMEN has been ISO9001:2008, owns and shares four modern facories which can provide quite a big range of qualified products to meet different needs of our customers, and every order has to be handled through our rigorous quality system. Test report is provided for each shipment, and each wafer are warranty.Before 1990, we are stated owned condensed matter physics research center. In 1990, center launched Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN), now it is a leading manufacturer of compound semiconductor material in China.
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
1990
Total Annual:
10 Million-50 Million
Employee Number:
50~100
Ecer Certification：
Active Member
Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai... Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...
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