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XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

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China 4" Silicon Epitaxial Wafer Top Layer Instrinct Silicon Layer / Phosphorus Doped
China 4" Silicon Epitaxial Wafer Top Layer Instrinct Silicon Layer / Phosphorus Doped

  1. China 4" Silicon Epitaxial Wafer Top Layer Instrinct Silicon Layer / Phosphorus Doped

4" Silicon Epitaxial Wafer Top Layer Instrinct Silicon Layer / Phosphorus Doped

  1. MOQ: 1-10,000pcs
  2. Price: By Case
  3. Get Latest Price
Payment Terms T/T
Supply Ability 10,000 wafers/month
Delivery Time 5-50 working days
product name 4 inch Silicon Epitaxial Wafe
brand powerway
application Digital, Linear, Power, MOS
EPI thickness 4μm to 150μm
Dopants: Arsenic phosphorus, boron
size 4"
Brand Name PAM-XIAMEN
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 10,000 wafers/month
Delivery Time 5-50 working days product name 4 inch Silicon Epitaxial Wafe
brand powerway application Digital, Linear, Power, MOS
EPI thickness 4μm to 150μm Dopants: Arsenic phosphorus, boron
size 4" Brand Name PAM-XIAMEN
Place of Origin China
High Light float zone waferepitaxial silicon wafer

4" Silicon Epitaxial Wafer Top Layer Instrinct Silicon Layer / Phosphorus Doped Layer Ion Implantation Layer Silicon Sub

 

Silicon epitaxial wafer is a layer of single crystal silicon deposited onto a single crystal silicon wafer(note: it is available to Grow a layer of poly crystalline Silicon layer on top of a highly doped Singly crystalline Silicon wafer, but it needs buffer layer (such as oxide or poly-Si) in between the bulk Si substrate and the top epitaxial layer)

The epitaxial layer can be doped, as it is deposited, to the precise doping concentration while continuing the substrate’s crystalline structure.

Epilayer resistivity: <1 ohm-cm up to 150 ohm-cm

Epilayer thickness: < 1 um up to 150 um

Structure: N/N+, N-/N/N+, N/P/N+, N/N+/P-, N/P/P+, P/P+, P-/P/P+.

Wafer Application: Digital, Linear, Power, MOS, BiCMOS Devices.

 

 

Our advantages at a glance

1. Advanced epitaxy growth equipment and test equipment.

2. Offer the highest quality with low defect density and good surface roughness.

3. Strong research team support and technology support for our customers

 

 

PAM-XIAMEN Epitaxial Wafer Services Specifications:

• Diameters: 50mm,75mm,100mm, 125mm, 150mm

• Wafer orientation: <100>, <111>, <110>

• EPI thickness: 4μm to 150μm

• Dopants: Arsenic, phosphorus, boron

• Typical resistivity ranges

• 0.05 – 1,200 ohm-cm

• 3000 – 5,000 ohm-cm (intrinsic layers)

 

 

4" Silicon Epitaxial Wafer Top Layer Instrinct Silicon layer / Phosphorus Doped Layer/Ion Implantation Layer/Silicon Substrate

 

4" Silicon Epitaxial Wafer
Si Epi Wafer Structure Top Layer Instrinct Silicon layer / Phosphorus Doped Layer/Ion Implantation Layer/Silicon Substrate
Top Layer Instrinct Silicon layer Risistivity≥50Ωcm,
Thickness 5μm,
Residual Carrier Concentration<1×1014/cm3
Phosphorus Doped Layer Risistivity Around 0.025Ωcm
(Concentration Doped Phosphorous 7×017/cm3),
Thickness 20μm,
Residual Carrier Concentration<2.1×1013/cm3
Ion Implantation Layer Customer Supply
Silicon Substrate Silicon Substrate1:
4" FZ Si Wafer
N type (100)
Thickness 500±15μm
Resistivity>2000Ωcm
DSP Double Side Polished

Silicon Substrate2:
4" Si Wafer
N Type (100), As(Arsenic) Doped,
Thickness 250±25μm,
Resistivity 0.001-0.005Ωcm
DSP Double Side Polished
Silicon Epitaxial Wafer Uniformity:
Phosphorus Doped Layer: Thickness Uniformity<4%, Resistivity Uniformity<4%
Instrinct Silicon Layer: Thickness Uniformity<4%, Resistivity Uniformity Around 10%
 

What is silicon epi wafer?

Epitaxy is a process in which an additional monocrystalline silicon layer is deposited on to the polished crystal surface of a silicon wafer. This process makes it possible to select the material properties independently of the polished substrate, and consequently to create wafers that have different properties in the substrate and the epitaxial layer. In many cases this is necessary for the semiconductor component’s function.

 

PAM-XIAMEN can offer you technology and wafer support, for more information, please visit our website: https://www.powerwaywafer.com,

send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Quality is our first priority. PAM-XIAMEN has been ISO9001:2008, owns and shares four modern facories which can provide quite a big range of qualified products to meet different needs of our customers, and every order has to be handled through our rigorous quality system. Test report is provided for each shipment, and each wafer are warranty.Before 1990, we are stated owned condensed matter physics research center. In 1990, center launched Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN), now it is a leading manufacturer of compound semiconductor material in China.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter,Seller

  • Year Established:

    1990

  • Total Annual:

    10 Million-50 Million

  • Employee Number:

    50~100

  • Ecer Certification:

    Active Member

  Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...   Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...

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Get in touch with us

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  • XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
  • #506B, Henghui Business Center, No.77, Lingxia Nan Road, High Technology Zone, Huli, Xiamen 361006, China
  • http://www.ganwafer.com/

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