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XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

  • China,Xiamen ,Fujian
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China A Plane Si-Doped GaN Freestanding Hexagonal GaN Crystal Substrate
China A Plane Si-Doped GaN Freestanding Hexagonal GaN Crystal Substrate

  1. China A Plane Si-Doped GaN Freestanding Hexagonal GaN Crystal Substrate

A Plane Si-Doped GaN Freestanding Hexagonal GaN Crystal Substrate

  1. MOQ: 1-10,000pcs
  2. Price: By Case
  3. Get Latest Price
Payment Terms T/T
Supply Ability 10,000 wafers/month
Delivery Time 5-50 working days
Packaging Details Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
Item PAM-FS-GAN A-SI
product name Si-GaN Freestanding GaN Substrate
Conduction Type Semi Insulating
Dimension 5 x 10 mm2
Thickness 350 ±25 μm 430±25μm
other name GaN Wafer
Brand Name PAM-XIAMEN
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 10,000 wafers/month
Delivery Time 5-50 working days Packaging Details Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
Item PAM-FS-GAN A-SI product name Si-GaN Freestanding GaN Substrate
Conduction Type Semi Insulating Dimension 5 x 10 mm2
Thickness 350 ±25 μm 430±25μm other name GaN Wafer
Brand Name PAM-XIAMEN Place of Origin China
High Light gallium nitride wafergan on silicon wafer

 

A Plane Si-Doped GaN Freestanding Hexagonal GaN Crystal Substrate

 

PAM-XIAMEN has established the manufacturing technology for freestanding (Gallium Nitride)GaN substrate wafer which is for UHB-LED and LD. Grown by hydride vapour phase epitaxy (HVPE) technology,Our GaN substrate has low defect density and less or free macro defect density.

 

PAM-XIAMEN offers full range of GaN and Related III-N Materials including GaN substrates of various orientations and electrical conductivity,crystallineGaN&AlN templates, and custom III-N epiwafers.

 

Here Shows Detail Specification:

A Plane Si-GaN Freestanding GaN Substrate

Item PAM-FS-GaN A-SI
Dimension 5 x 10 mm2
Thickness 350 ±25 µm 430±25 µm
Orientation

A plane (11-20) off angle toward M-axis 0 ±0.5°

A plane (11-20) off angle toward C-axis -1 ±0.2°

Conduction Type Semi-Insulating
Resistivity (300K) > 10 6Ω·cm
TTV ≤ 10 µm
BOW -10 µm ≤ BOW ≤ 10 µm
Surface Roughness:

Front side: Ra<0.2nm, epi-ready;

Back side: Fine Ground or polished.

Dislocation Density From 1 x 10 5to 5 x 106 cm-2
Macro Defect Density 0 cm-2
Useable Area > 90% (edge exclusion)
Package each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A Plane Si-GaN Freestanding GaN Substrate

The growing demand for high-speed, high-temperature and high power-handling capabilities has made the semiconductor industry rethink the choice of materials used as semiconductors. For instance, as various faster and smaller computing devices arise, the use of silicon is making it difficult to sustain Moore’s Law. But also in power electronics, the properties of silicon are no longer sufficient to allow further improvements in conversion efficiency.

 

Due to its unique characteristics (high maximum current, high breakdown voltage, and high switching frequency), Gallium Nitride (or GaN) is the unique material of choice to solve energy problems of the future. GaN based systems have higher power efficiency, thus reducing power losses, switch at higher frequency, thus reducing size and weight.

 

 

XRD Rocking Curves-GaN Material-TEST REPORT

 

A test report is necessary to show the compliance between custom description and our final wafers data. We will test the wafer characerization by equipment before shipment, testing surface roughness by atomic force microscope, type by Roman spectra instrument, resistivity by non-contact resistivity testing equipment,micropipe density by polarizing microscope, orientation by X-ray Orientator etc. if the wafers meet the requirement, we will clean and pack them in 100 class clean room, if the wafers do not match the custom spec, we will take it off.

 

The half-height full width (FWHM) is an expression of the range of functions given by the difference between two extreme values of the independent variable equal to half of its maximum. In other words, it is the width of the spectral curve measured between those points on the Y-axis, which is half the maximum amplitude.

 

Below is an example of XRD Rocking Curves of GaN Material:

 

XRD Rocking Curves of GaN Material

 

Company Details

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Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter,Seller

  • Year Established:

    1990

  • Total Annual:

    10 Million-50 Million

  • Employee Number:

    50~100

  • Ecer Certification:

    Active Member

  Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...   Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...

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  • XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
  • #506B, Henghui Business Center, No.77, Lingxia Nan Road, High Technology Zone, Huli, Xiamen 361006, China
  • http://www.ganwafer.com/

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