XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
| Payment Terms | T/T |
| Supply Ability | 10,000 wafers/month |
| Delivery Time | 5-50 working days |
| Packaging Details | Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere |
| product name | InAs Substrate Wafer |
| Wafer Diamter | 3 inch |
| Conduction Type | P Type |
| Grade | Prime Grade |
| Wafer Thickness | 600±25um |
| keyword | single crystal Indium arsenide Wafer |
| Brand Name | PAM-XIAMEN |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10,000 wafers/month |
| Delivery Time | 5-50 working days | Packaging Details | Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere |
| product name | InAs Substrate Wafer | Wafer Diamter | 3 inch |
| Conduction Type | P Type | Grade | Prime Grade |
| Wafer Thickness | 600±25um | keyword | single crystal Indium arsenide Wafer |
| Brand Name | PAM-XIAMEN | Place of Origin | China |
| High Light | indium arsenide wafer ，3 inch wafer | ||
P Type , Single Crystal InAs Substrate , 3”, Prime Grade
PAM-XIAMEN manufactures high purity single crystal Indium arsenide Wafers for optoelectronics applications. Our standard wafer diameters range from 25.4 mm (1 inch) to 100 mm (6 inches) in size; wafers can be produced in various thicknesses and orientations with polished or unpolished sides and can include dopants. PAM-XIAMEN can produce wide range grades: prime grade, mechanical grade,test grade, dummy grade, technical grade, and optical grade. PAM-XIAMEN also offers materials to customer specifications by request, in addition to custom compositions for commercial and research applications and new proprietary technologies.
3" InAs Wafer Specification
| Item | Specifications |
| Dopant | Zinc |
| Conduction Type | P-type |
| Wafer Diameter | 3" |
| Wafer Orientation | (100)±0.5° |
| Wafer Thickness | 600±25um |
| Primary Flat Length | 22±2mm |
| Secondary Flat Length | 11±1mm |
| Carrier Concentration | (1-10)x1017cm-3 |
| Mobility | 100-400cm2/V.s |
| EPD | <3x104cm-2 |
| TTV | <12um |
| BOW | <12um |
| WARP | <15um |
| Laser marking | upon request |
| Suface finish | P/E, P/P |
| Epi ready | yes |
| Package | Single wafer container or cassette |
What is InAs wafer?
Indium arsenide is a kind of III-V compound semiconductor material composed of indium and arsenic.It is a silver gray solid with a sphalerite crystal structure at room temperature. The lattice constant is 0.6058nm, and the density is 5.66g/cm (solid) and 5.90g/cm (liquid at melting point). The band structure is a direct transition with a band gap (300K) of 0.45ev. the dissociation pressure of as is only 0.033mpa, and the single crystal can be grown from the melt at atmospheric pressure. The commonly used methods are Hb and LEC. InAs is a kind of semiconductor material which is difficult to purify. The residual carrier concentration is higher than l × 10 / cm, the room temperature electron mobility is 3.3 × 10 ^ 3cm / (V · s), and the hole mobility is 460cm / (V · s). The effective segregation coefficient of sulfur in In and As is close to 1, so it is used as n-type dopant to improve the uniformity of longitudinal carrier concentration distribution. For industrial InAs (s) single crystal, n ≥ 1 × 10 / cm3, μ ≤ 2.0 × 10cm / (V · s), EPD ≤ 5 × 10 / cm3.
InAs crystal has high electron mobility and mobility ratio (μ E / μ H = 70), low magneto resistance effect and low resistance temperature coefficient. It is an ideal material for manufacturing Hall devices and magneto resistance devices. The emission wavelength of InAs is 3.34 μ M. in GaAs B, InAsPSb and inasb multiple epitaxial materials with lattice matching can be grown on InAs substrate. Lasers and detectors for optical fiber communication at 2-4 μ M band can be manufactured.
What is a InAs test Wafer?
Most test wafers are wafers which have fallen out of prime specifications. Test wafers may be used to run marathons, test equipment and for high-end R & D. They are often a cost-effective alternative to prime wafers.
| Breakdown field | ≈4·104 V cm-1 |
| Mobility of electrons | ≤4·104 cm2V-1s-1 |
| Mobility of holes | ≤5·102 cm2 V-1s-1 |
| Diffusion coefficient of electrons | ≤103 cm2s-1 |
| Diffusion coefficient of holes | ≤13 cm2 s-1 |
| Electron thermal velocity | 7.7·105 m s-1 |
| Hole thermal velocity | 2·105 m s-1 |
| Electron Hall mobility versus temperature for different electron concentration: full triangles no= 4·1015 cm-3, circles no= 4·1016cm-3, open triangles no= 1.7·1016cm-3. Solid curve-calculation for pure InAs. | ||||||||||||||||||||||||||||||||
| Electron Hall mobility versus electron concentration. T = 77 K. | ||||||||||||||||||||||||||||||||
| Electron Hall mobility versus electron concentration T = 300 K | ||||||||||||||||||||||||||||||||
| Electron Hall mobility (R·σ) in compensated material
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| Electron Hall mobility versus transverse magnetic field, T = 77 K. Nd (cm-3): 1. 1.7·1016; 2. 5.8·1016. |
At T = 300 K the electron Hall factor in pure n-InAs rH ~1.3.
| Hole Hall mobility (R·σ) versus temperature for different acceptor densities. Hole concentration at 300 K po (cm-3): 1. 5.7·1016; 2. 2.6·1017; 3. 4.2·1017; 4. 1.3·1018. |
| Hall coefficient versus temperature for different acceptor densities. Hole concentration at 300 K po (cm-3): 1. 5.7·1016; 2. 2.6·1017; 3. 4.2·1017; 4. 1.3·1018. |
| Steady state field dependence of the electron drift velocity, 300 K, F || (100). Theoretical calculation |
| Field dependence of the electron drift velocity at different transverse magnetic fields for long (microsecond) pulses. Experimental results, 77 K Magnetic field B(T): 1. 0.0; 2. 0.3; 3. 0.9; 4. 1.5. |
| Field dependence of the electron drift velocity, 77 K. Solid lines show results of theoretical calculation for different non-parabolicity α (eV-1): 1. 2.85; 2. 2.0; 3. 1.5. Points show experimental results for very short (pico-second pulses) |
| The dependence of ionization rates for electrons αi and holes βi versus 1/F, T =77K |
αi = αoexp(-Fno/ F)
αo = 1.8·105 cm-1;
Fno = 1.6·105 V cm-1 (77 K)
βi = βoexp(-Fpo/ F)
At 77 K
| 1.5·104 V cm-1 < F < 3·104 V cm-1 | 3·104 V cm-1 < F < 6·104 V cm-1 |
| βo = 4.7·105 cm-1; | βo = 4.5·106 cm-1; |
| Fpo = 0.85·105 V cm-1. | Fpo = 1.54·105 V cm-1 |
| Generation rate g versus electric field for relatively low fields, T = 77 K. Solid line shows result of calculation. Experimental results: open and full circles -undoped InAs, open triangles - compensated InAs. |
| Breakdown voltage and breakdown field versus doping density for an abrupt p-n junction, 77 K. |
| Pure n-type material (no =2·10-15cm-3) | |
| The longest lifetime of holes | τp ~ 3·10-6 s |
| Diffusion length Lp | Lp ~ 10 - 20 µm. |
| Pure p-type material | |
| The longest lifetime of electrons | τn ~ 3·10-8 s |
| Diffusion length Ln | Ln ~ 30 - 60 µm |
Characteristic surface recombination rates (cm s-1) 102 - 104.
| 77 K | 1.2·10-9 cm3s-1 |
| 298 K | 1.1·10-10 cm3s-1 |
| 300 K | 2.2·10-27cm3s-1 |
Are You Looking for an InAs substrate?
PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for InAs wafers, send us enquiry today to learn more about how we can work with you to get you the InAs wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
1990
Total Annual:
10 Million-50 Million
Employee Number:
50~100
Ecer Certification：
Active Member
Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai... Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...
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