XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
| Payment Terms | T/T |
| Supply Ability | 10,000 wafers/month |
| Delivery Time | 5-50 working days |
| Brand Name | PAM-XIAMEN |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 10,000 wafers/month |
| Delivery Time | 5-50 working days | Brand Name | PAM-XIAMEN |
| Place of Origin | China | ||
| High Light | n type wafer ，3 inch wafer | ||
PAM-XIAMEN offers Compound Semiconductor InAs wafer - Indium arsenide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).
Indium arsenide, InAs, is a semiconductor composed of indium and arsenic. It has the appearance of grey cubic crystals with a melting point of 942 °C. Indium arsenide is used for construction of infrared detectors, for the wavelength range of 1–3.8 µm. The detectors are usually photovoltaic photodiodes. Cryogenically cooled detectors have lower noise, but InAs detectors can be used in higher-power applications at room temperature as well. Indium arsenide is also used for making of diode lasers.
Indium arsenide is similar to gallium arsenide and is a direct bandgap material. Indium arsenide is sometimes used together with indium phosphide. Alloyed with gallium arsenide it forms indium gallium arsenide - a material with band gap dependent on In/Ga ratio, a method principally similar to alloying indium nitridewith gallium nitride to yield indium gallium nitride.
Here is the detail specification:
2"(50.8mm)InAs Wafer Specification
3"(76.2mm)InAs Wafer Specification
4"(100mm)InAs Wafer Specification
2" InAs Wafer Specification
| Item | Specifications | |||
| Dopant | Undoped | Stannum | Sulphur | Zinc |
| Conduction Type | N-type | N-type | N-type | P-type |
| Wafer Diameter | 2" | |||
| Wafer Orientation | (100)±0.5° | |||
| Wafer Thickness | 500±25um | |||
| Primary Flat Length | 16±2mm | |||
| Secondary Flat Length | 8±1mm | |||
| Carrier Concentration | 5x1016cm-3 | (5-20)x1017cm-3 | (1-10)x1017cm-3 | (1-10)x1017cm-3 |
| Mobility | ≥2x104cm2/V.s | 7000-20000cm2/V.s | 6000-20000cm2/V.s | 100-400cm2/V.s |
| EPD | <5x104cm-2 | <5x104cm-2 | <3x104cm-2 | <3x104cm-2 |
| TTV | <10um | |||
| BOW | <10um | |||
| WARP | <12um | |||
| Laser marking | upon request | |||
| Suface finish | P/E, P/P | |||
| Epi ready | yes | |||
| Package | Single wafer container or cassette | |||
3" InAs Wafer Specification
| Item | Specifications | |||
| Dopant | Undoped | Stannum | Sulphur | Zinc |
| Conduction Type | N-type | N-type | N-type | P-type |
| Wafer Diameter | 3" | |||
| Wafer Orientation | (100)±0.5° | |||
| Wafer Thickness | 600±25um | |||
| Primary Flat Length | 22±2mm | |||
| Secondary Flat Length | 11±1mm | |||
| Carrier Concentration | 5x1016cm-3 | (5-20)x1017cm-3 | (1-10)x1017cm-3 | (1-10)x1017cm-3 |
| Mobility | ≥2x104cm2/V.s | 7000-20000cm2/V.s | 6000-20000cm2/V.s | 100-400cm2/V.s |
| EPD | <5x104cm-2 | <5x104cm-2 | <3x104cm-2 | <3x104cm-2 |
| TTV | <12um | |||
| BOW | <12um | |||
| WARP | <15um | |||
| Laser marking | upon request | |||
| Suface finish | P/E, P/P | |||
| Epi ready | yes | |||
| Package | Single wafer container or cassette | |||
4" InAs Wafer Specification
| Item | Specifications | |||
| Dopant | Undoped | Stannum | Sulphur | Zinc |
| Conduction Type | N-type | N-type | N-type | P-type |
| Wafer Diameter | 4" | |||
| Wafer Orientation | (100)±0.5° | |||
| Wafer Thickness | 900±25um | |||
| Primary Flat Length | 16±2mm | |||
| Secondary Flat Length | 8±1mm | |||
| Carrier Concentration | 5x1016cm-3 | (5-20)x1017cm-3 | (1-10)x1017cm-3 | (1-10)x1017cm-3 |
| Mobility | ≥2x104cm2/V.s | 7000-20000cm2/V.s | 6000-20000cm2/V.s | 100-400cm2/V.s |
| EPD | <5x104cm-2 | <5x104cm-2 | <3x104cm-2 | <3x104cm-2 |
| TTV | <15um | |||
| BOW | <15um | |||
| WARP | <20um | |||
| Laser marking | upon request | |||
| Suface finish | P/E, P/P | |||
| Epi ready | yes | |||
| Package | Single wafer container or cassette | |||
1)2”(50.8mm)InAs
Type/Dopant:N/S
Orientation:[111B]±0.5°
Thickness:500±25um
Epi-Ready
SSP
2)2”(50.8mm)InAs
Type/Dopant:N/Undoped
Orientation : (111)B
Thickness:500um±25um
SSP
3)2”(50.8mm)InAs
Type/Dopant:N Un-doped
Orientation : <111>A ±0.5°
Thickness:500um±25um
epi-ready
Ra<=0.5nm
Carrier Concentration(cm-3):1E16~3E16
Mobility(cm -2 ):>20000
EPD(cm -2 ):<15000
SSP
4)2”(50.8mm)InAs
Type/Dopant:N/Undoped
Orientation : <100> with [001]O.F.
Thickness:2mm
AS cut
5)2”(50.8mm)InAs
Type/Dopant:N/P
Orientation :(100),
Carrier Concentration(cm-3):(5-10)E17,
Thickness:500 um
SSP
All wafers are offered with high quality epitaxy ready finishing. Surfaces are characterised by in-house, advanced optical metrology techniques which include Surfscan haze and particle monitoring, spectroscopic ellipsometry and grazing incidence interferometry
The influence of annealing temperature on the optical properties of surface electron accumulation layers in n-type (1 0 0) InAs wafers has been investigated by Raman spectroscopy. It exhibits that Raman peaks due to scattering by unscreened LO phonons disappear with increasing temperature, which indicates that the electron accumulation layer in InAs surface is eliminated by annealing. The involved mechanism was analyzed by X-ray photoelectron spectroscopy, X-ray diffraction and high-resolution transmission electron microscopy. The results show that amorphous In2O3 and As2O3 phases are formed at InAs surface during annealing and, meanwhile, a thin crystalline As layer at the interface between the oxidized layer and the wafer is also generated which leads to a decrease in thickness of the surface electron accumulation layer since As adatoms introduce acceptor type surface states.
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Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
1990
Total Annual:
10 Million-50 Million
Employee Number:
50~100
Ecer Certification：
Active Member
Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai... Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...
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