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XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

  • China,Xiamen ,Fujian
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China N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade
China N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade

  1. China N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade

N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade

  1. MOQ: 1-10,000pcs
  2. Price:
  3. Get Latest Price
Payment Terms T/T
Supply Ability 10,000 wafers/month
Delivery Time 5-50 working days
Packaging Details Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
product name polycrystalline GaAs wafer
Wafer Diamter 4 inch
Package Single wafer container or cassette
Grade Test Grade
usage LED Application
keyword GaAs Gallium Arsenide wafer
Brand Name PAM-XIAMEN
Place of Origin China

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  1. Product Details
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Product Specification

Payment Terms T/T Supply Ability 10,000 wafers/month
Delivery Time 5-50 working days Packaging Details Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
product name polycrystalline GaAs wafer Wafer Diamter 4 inch
Package Single wafer container or cassette Grade Test Grade
usage LED Application keyword GaAs Gallium Arsenide wafer
Brand Name PAM-XIAMEN Place of Origin China
High Light gallium arsenide waferp type silicon wafer

N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade

 

PAM-XIAMEN provides both single crystal and polycrystalline GaAs wafer ( Gallium Arsenide ) for opto-electronics and micro-electronics industry for making LD , LED , microwave circuit and solar cell applications , the wafers is in diameter range from 2" to 6" in various thicknesses and orientations. We offer single crystal GaAs wafer produced by two main growth techniques LEC and VGF method , allowing us to provide customers the widest choice of GaAs material with high uniformity of electrical properties and excellent surface quality . Gallium Arsenide can be supplied as ingots and polished wafer, both conducting and semi-insulating GaAs wafer , mechanical grade and epi ready grade are all available . We can offer GaAs wafer with low EPD value and high surface quality suitable for your MOCVD and MBE applications. PAM-XIAMEN can produce wide range grades: prime grade, test grade, and optical grade. Please contact our engineer team for more wafer information.

(GaAs)Gallium Arsenide Wafers for LED Applications

Item Specifications  
Conduction Type SC/n-type
Growth Method VGF
Dopant Silicon
Wafer Diamter 4, inch
Crystal Orientation (100)2°/6°/15° off (110)
OF EJ or US
Carrier Concentration

(0.4~2.5)E18/cm3

 

Resistivity at RT (1.5~9)E-3 Ohm.cm
Mobility

1500~3000cm2/V.sec

 

Etch Pit Density <5000/cm2
Laser Marking

upon request

 

Surface Finish

P/E or P/P

 

Thickness

220~450um

 

Epitaxy Ready Yes
Package Single wafer container or cassette

 

(GaAs)Gallium Arsenide Wafers for LD Applications

Item Specifications Remarks
Conduction Type SC/n-type  
Growth Method VGF  
Dopant Silicon  
Wafer Diamter 4, inch Ingot or as-cut available
Crystal Orientation (100)2°/6°/15°off (110) Other misorientation available
OF EJ or US  
Carrier Concentration (0.4~2.5)E18/cm3  
Resistivity at RT (1.5~9)E-3 Ohm.cm  
Mobility 1500~3000 cm2/V.sec  
Etch Pit Density <500/cm2  
Laser Marking upon request  
Surface Finish P/E or P/P  
Thickness 220~350um  
Epitaxy Ready Yes  
Package Single wafer container or cassette

Properties of GaAs Crystal

Properties GaAs
Atoms/cm3 4.42 x 1022
Atomic Weight 144.63
Breakdown Field approx. 4 x 105
Crystal Structure Zincblende
Density (g/cm3) 5.32
Dielectric Constant 13.1
Effective Density of States in the Conduction Band, Nc (cm-3) 4.7 x 1017
Effective Density of States in the Valence Band, Nv (cm-3) 7.0 x 1018
Electron Affinity (V) 4.07
Energy Gap at 300K (eV) 1.424
Intrinsic Carrier Concentration (cm-3) 1.79 x 106
Intrinsic Debye Length (microns) 2250
Intrinsic Resistivity (ohm-cm) 108
Lattice Constant (angstroms) 5.6533
Linear Coefficient of Thermal Expansion, 6.86 x 10-6
ΔL/L/ΔT (1/deg C)
Melting Point (deg C) 1238
Minority Carrier Lifetime (s) approx. 10-8
Mobility (Drift) 8500
(cm2/V-s)
µn, electrons
Mobility (Drift) 400
(cm2/V-s)
µp, holes
Optical Phonon Energy (eV) 0.035
Phonon Mean Free Path (angstroms) 58
Specific Heat 0.35
(J/g-deg C)
Thermal Conductivity at 300 K 0.46
(W/cm-degC)
Thermal Diffusivity (cm2/sec) 0.24
Vapor Pressure (Pa) 100 at 1050 deg C;
1 at 900 deg C

 

 
Wavelength Index
(µm)
2.6 3.3239
2.8 3.3204
3 3.3169
3.2 3.3149
3.4 3.3129
3.6 3.3109
3.8 3.3089
4 3.3069
4.2 3.3057
4.4 3.3045
4.6 3.3034
4.8 3.3022
5 3.301
5.2 3.3001
5.4 3.2991
5.6 3.2982
5.8 3.2972
6 3.2963
6.2 3.2955
6.4 3.2947
6.6 3.2939
6.8 3.2931
7 3.2923
7.2 3.2914
7.4 3.2905
7.6 3.2896
7.8 3.2887
8 3.2878
8.2 3.2868
8.4 3.2859
8.6 3.2849
8.8 3.284
9 3.283
9.2 3.2818
9.4 3.2806
9.6 3.2794
9.8 3.2782
10 3.277
10.2 3.2761
10.4 3.2752
10.6 3.2743
10.8 3.2734
11 3.2725
11.2 3.2713
11.4 3.2701
11.6 3.269
11.8 3.2678
12 3.2666
12.2 3.2651
12.4 3.2635
12.6 3.262
12.8 3.2604
13 3.2589
13.2 3.2573
13.4 3.2557
13.6 3.2541

 

What is the GaAs Process?

GaAs wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.

 

What is the Basic Parameters at 300 K of GaAs Wafer?

Crystal structure Zinc Blende
Group of symmetry Td2-F43m
Number of atoms in 1 cm3 4.42·1022
de Broglie electron wavelength 240 A
Debye temperature 360 K
Density 5.32 g cm-3
Dielectric constant (static ) 12.9
Dielectric constant (high frequency) 10.89
Effective electron mass me 0.063mo
Effective hole masses mh 0.51mo
Effective hole masses mlp 0.082mo
Electron affinity 4.07 eV
Lattice constant 5.65325 A
Optical phonon energy 0.035 eV

 

Are You Looking for GaAs substrate?

PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for GaAs wafers, send us enquiry today to learn more about how we can work with you to get you the GaAs wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!

Company Details

Bronze Gleitlager

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Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Exporter,Seller

  • Year Established:

    1990

  • Total Annual:

    10 Million-50 Million

  • Employee Number:

    50~100

  • Ecer Certification:

    Active Member

  Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...   Xiamen Powerway Advanced Material Co.,Limited(PAM-XIAMEN) is a high-tech enterprise for compound semiconductor material integrating semiconductor crystal growth, process development and epitaxy, specializing in the research and production of compound semiconductor wafers, there are two mai...

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  • XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
  • #506B, Henghui Business Center, No.77, Lingxia Nan Road, High Technology Zone, Huli, Xiamen 361006, China
  • http://www.ganwafer.com/

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