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SHANGHAI FAMOUS TRADE CO.,LTD

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China TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized
China TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized

  1. China TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized
  2. China TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized
  3. China TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized
  4. China TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized

TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via TGV Customized

  1. MOQ:
  2. Price: By case
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Payment Terms T/T
Material: Sapphire
Size: Customized
Diameter: Customizable
Thickness: <1.1 Mm
Positional Accuracy: ±3 µm
Super Smooth Sidewalls: RA < 0,08 µm
Brand Name ZMSH
Model Number Through Glass Via (TGV)
Certification rohs
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Material: Sapphire
Size: Customized Diameter: Customizable
Thickness: <1.1 Mm Positional Accuracy: ±3 µm
Super Smooth Sidewalls: RA < 0,08 µm Brand Name ZMSH
Model Number Through Glass Via (TGV) Certification rohs
Place of Origin CHINA
High Light TGV Sapphire Wafer Perforated Glass SubstrateCustomized Sapphire Wafer Perforated Glass Substrate

 

 

Abstract

 

 

TGV Sapphire Wafer Perforated Glass Substrate Through Glass Via (TGV) Customized

 


 

The TGV sapphire wafer with laser-drilled apertures is an advanced substrate material fabricated by forming high-precision through-glass vias (TGV) on single-crystal sapphire (Al₂O₃) substrates via laser or etching processes. It combines sapphire’s exceptional hardness, high-temperature resistance, and optical transparency with TGV’s micro/nano-structuring capabilities.

 

 


 

Technical parameters

 

 

Specification Value
Glass Thickness <1.1 mm
Wafer Sizes All standard up to 200 mm
Minimum Microhole Diameter 10 µm
Identical Hole Diameter 99%
Positional Accuracy ±3 µm
Chipping None
Super Smooth Sidewalls RA < 0.08 µm
Hole Types Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse)
Hole Shape Hourglass
Option Singulation from hole-processed large-sized glass

 

 


Key Features

 

 

- High Mechanical Strength: Mohs hardness of 9, scratch-resistant, and corrosion-resistant.

  •  

- Superior Thermal Stability: Withstands extreme temperatures (>2000°C) and exhibits low thermal expansion.

  •  

- Precision Through-Holes: Laser/photolithography enables micron-scale apertures with high aspect ratios.

  •  

- Optical Performance: Broadband transparency (80%+ @400-5000nm) from UV to IR wavelengths.

  •  

- Dielectric Properties: Excellent insulation (resistivity >10¹⁴ Ω·cm).

 

 


Applications

 

- Semiconductor Packaging: Heterogeneous integration substrate for 3D ICs and MEMS sensors (e.g., pressure/inertial sensors).

 

- Optoelectronic Devices: Transparent interposer for Micro-LEDs and vertical-cavity surface-emitting lasers (VCSELs).

 

- RF Components: 5G/mmWave antenna packaging (low dielectric loss).

 

- Biochips: Chemically inert transparent layer for microfluidic chips.

 

- Extreme-Environment Sensors: Aerospace and deep-well sensor windows.

 

 


 

Machining effect

 

Our advanced TGV wafers are engineered to enable high-performance metallization of microvias, ensuring optimal conductivity and structural integrity for cutting-edge applications.

 

We specialize in manufacturing TGV wafers with bespoke dimensions and microvia designs, tailored to seamlessly integrate with your preferred metallization processes—whether electroless plating, sputtering, or electroplating.

 

 

 


 


 

Product display

 

Our TGV glass wafers are precision-fabricated to deliver exceptional surface quality, enabling direct integration into your production workflow with minimal post-processing. High-density microvia arrays are uniformly distributed to meet stringent industry standards.

 

From concept to commercialization, we provide agile prototyping and high-volume production services to support your unique design requirements. Our flexible manufacturing capabilities ensure fast turnaround without compromising precision or reliability.

 

 

 

 


 

Q&A​

 

1. Q: What are the advantages of sapphire TGV wafers over traditional glass substrates?
    A: Sapphire TGV wafers offer superior mechanical strength, higher temperature resistance (>2000°C), and better chemical stability compared to standard glass substrates.

 

 

2. Q: What applications are sapphire TGV wafers best suited for?
    A: They are ideal for advanced semiconductor packaging, high-power LED devices, and RF components requiring extreme durability and precision microstructures.


 


Tag: #TGV, #TGV Sapphire Wafer Perforated Glass Substrate, #Customized, #Through Glass Via (TGV), #BF33, #JGS1, #JGS2, #Sapphire

 

 

 

Company Details

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 from Quality China Factory
  • Business Type:

    Manufacturer,Agent,Importer,Exporter,Trading Company

  • Year Established:

    2013

  • Total Annual:

    1000000-1500000

  • Ecer Certification:

    Verified Supplier

    SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.    We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...     SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.    We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...

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Get in touch with us

  • Reach Us
  • SHANGHAI FAMOUS TRADE CO.,LTD
  • Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
  • https://www.galliumnitridewafer.com/

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