China factories

China factory - SHANGHAI FAMOUS TRADE CO.,LTD

SHANGHAI FAMOUS TRADE CO.,LTD

  • China,Shanghai ,Shanghai
  • Verified Supplier

Leave a Message

we will call you back quickly!

Submit Requirement
China Microjet laser technology equipment wafer slice metal silicon carbide material
China Microjet laser technology equipment wafer slice metal silicon carbide material

  1. China Microjet laser technology equipment wafer slice metal silicon carbide material
  2. China Microjet laser technology equipment wafer slice metal silicon carbide material
  3. China Microjet laser technology equipment wafer slice metal silicon carbide material
  4. China Microjet laser technology equipment wafer slice metal silicon carbide material

Microjet laser technology equipment wafer slice metal silicon carbide material

  1. MOQ: 1
  2. Price: By case
  3. Get Latest Price
Payment Terms T/T
Delivery Time 5-10months
Purpose: Microjet laser technology equipment
Countertop volume: 300*300*150
Positioning accuracy μm: +/-5
Repeated positioning accuracy μm: +/-2
Numerical control type: DPSS Nd:YAG
Wavelength: 532/1064
Brand Name ZMSH
Model Number Microjet laser technology equipment
Certification rohs
Place of Origin CHINA

View Detail Information

Contact Now Ask for best deal
Get Latest Price Request a quote
  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Delivery Time 5-10months
Purpose: Microjet laser technology equipment Countertop volume: 300*300*150
Positioning accuracy μm: +/-5 Repeated positioning accuracy μm: +/-2
Numerical control type: DPSS Nd:YAG Wavelength: 532/1064
Brand Name ZMSH Model Number Microjet laser technology equipment
Certification rohs Place of Origin CHINA

Abstract of microjet laser technology equipment

 

Microjet laser technology equipment wafer slice metal silicon carbide material

 

 

Microjet Laser systems enable ultra-precision machining of semiconductor materials by coupling high-energy pulsed lasers to micron-scale liquid jets (usually deionized water or inert liquids), using the guiding and cooling effects of the liquid jets.

 

With high precision, low damage and high cleanliness, microjet laser technology is replacing traditional machining and dry laser processes in the semiconductor field, especially in third-generation semiconductors (SiC/GaN), 3D packaging and ultra-thin wafer processing.

 

 


 

Microjet laser processing

 

 

 

 


 

Technical specifications

 

Countertop volume 300*300*150 400*400*200
Linear axis XY Linear motor. Linear motor Linear motor. Linear motor
Linear axis Z 150 200
Positioning accuracy μm +/-5 +/-5
Repeated positioning accuracy μm +/-2 +/-2
Acceleration G 1 0.29
Numerical control 3 axis /3+1 axis /3+2 axis 3 axis /3+1 axis /3+2 axis
Numerical control type DPSS Nd:YAG DPSS Nd:YAG
Wavelength nm 532/1064 532/1064
Rated power W 50/100/200 50/100/200
Water jet 40-100 40-100
Nozzle pressure bar 50-100 50-600
Dimensions (machine tool) (width * length * height) mm 1445*1944*2260 1700*1500*2120
Size (control cabinet) (W * L * H) 700*2500*1600 700*2500*1600
Weight (equipment) T 2.5 3
Weight (control cabinet) KG 800 800

Processing capability

Surface roughness Ra≤1.6um

Opening speed ≥1.25mm/s

Circumference cutting ≥6mm/s

Linear cutting speed ≥50mm/s

Surface roughness Ra≤1.2um

Opening speed ≥1.25mm/s

Circumference cutting ≥6mm/s

Linear cutting speed ≥50mm/s

 

For gallium nitride crystal, ultra-wide band gap semiconductor materials (diamond/Gallium oxide), aerospace special materials, LTCC carbon ceramic substrate, photovoltaic, scintillator crystal and other materials processing.

Note: Processing capacity varies depending on material characteristics

 

 

 


Microjet laser equipment technical advantages

 

1. Small loss of processing materials and processing equipment


2. Greatly reduce grinding links


3. Low labor cost of automated processing


4. High quality machining wall and cutting edge


5. Clean processing without environmental pollution


6. High processing efficiency


7. High processing yield

 

 


 

Microfluidic laser silicon wafer scribing

 

Test with the debugging processing parameters, and the cutting effect is shown in the figure below. The cutting width of 40μm nozzle is 35um; After the cutting is completed, the wafer is completely scratched, and the back of the cutting tape (UV film) is basically intact and not scratched through. There is no cracking and crack on the edge of the crossing, which meets the processing requirements.

 

 

 

 


 

Q&A​

 

1. Q: What are the main advantages of microjet laser technology equipment?
    A: The advantages of microjet laser technology equipment include high-precision processing, good cooling effect, no heat affected zone, parallel cutting edge and efficient processing performance, which is suitable for the precision processing of hard and brittle materials.

 

 

2.Q: In what fields are microjet laser technology equipment used?
   A: Microjet laser technology equipment is widely used in the third generation of semiconductors, aerospace materials, diamond cutting, metallized diamond, ceramic substrate and other fields.

 

 


Tag: #Microjet Island laser equipment, #Microjet laser technology, #Semiconductor wafer processing, #Wafer slice, #Silicon carbide material, #Wafer dicing, #Metal

 

 

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Agent,Importer,Exporter,Trading Company

  • Year Established:

    2013

  • Total Annual:

    1000000-1500000

  • Ecer Certification:

    Verified Supplier

    SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.    We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...     SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.    We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...

+ Read More

Get in touch with us

  • Reach Us
  • SHANGHAI FAMOUS TRADE CO.,LTD
  • Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799
  • https://www.galliumnitridewafer.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement