SHANGHAI FAMOUS TRADE CO.,LTD
Products
Manufacturer of a wide range of products which include Microjet Laser Equipment High Energy Pulsed Laser Chip Microhole And TSV Processing LASER MICROJET LMJ,High Purity Copper Connection Wire Copper Soft Connection Cables Are Con...
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Purpose: | Microjet laser technology equipment |
| Countertop volume: | 300*300*150 |
| Positioning accuracy μm: | +/-5 |
| Repeated positioning accuracy μm: | +/-2 |
| Numerical control type: | DPSS Nd:YAG |
| Wavelength: | 532/1064 |
| Brand Name | ZMSH |
| Model Number | Microjet laser technology equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ:
Price: By case
| Payment Terms | T/T |
| Delivery Time | 2-4weeks |
| Products: | High purity copper wire |
| Purity Cu: | 99.999%~99.999999%(5N-8N) |
| Specs range: | 10-200um can be customized upon request |
| Resistivity: | 1.68×10⁻⁸Ω·m (20℃) |
| Thermal conductivity: | 401W/(m·K) |
| Applications: | Power transmission, electronic connection |
| Brand Name | ZMSH |
| Model Number | Copper connection wire |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ:
Price: By case
| Payment Terms | T/T |
| Delivery Time | 2-4weeks |
| Products: | Copper Heat Sink substrate |
| Copper purity: | Cu≥99.9% |
| Type: | Flat Base and Pin-Fin |
| Thermal conductivity: | ≥380W/(m·K) |
| Tensile strength: | 200-350MPa |
| Applications: | Laser diode (LD), 5G RF devices |
| Brand Name | ZMSH |
| Model Number | Copper Heat Sink Substrate |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ:
Price: By case
| Payment Terms | T/T |
| Material composition: | C, O, Si |
| Shore hardness (A) : | 50~55 |
| Elastic recovery coefficient: | 1.28 |
| Upper tolerance temperature: | 260℃ |
| Friction coefficient: | 1.8 |
| PLASMA resistance: | Tolerance |
| Brand Name | ZMSH |
| Model Number | Bionic non-slip pad |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Purpose: | Microfluidic laser equipment |
| Countertop volume: | 300*300*150 |
| Positioning accuracy μm: | +/-5 |
| Repeated positioning accuracy μm: | +/-2 |
| Numerical control type: | DPSS Nd:YAG |
| Wavelength: | 532/1064 |
| Brand Name | ZMSH |
| Model Number | Microfluidic laser equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Purpose: | Microjet laser technology equipment |
| Countertop volume: | 300*300*150 |
| Positioning accuracy μm: | +/-5 |
| Repeated positioning accuracy μm: | +/-2 |
| Numerical control type: | DPSS Nd:YAG |
| Wavelength: | 532/1064 |
| Brand Name | ZMSH |
| Model Number | Microjet laser technology equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 2
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Bonding Methods: | Room Temperature Bonding |
| Compatible Wafer Sizes: | ≤12 Inch, Compatible With Irregular Shaped Samples |
| Compatible Materials: | Sapphire, InP, SiC, GaAs, GaN, Diamond, Glass, Etc |
| Max Pressure Of Press System: | 100 KN |
| Alignment Method & Precision: | Edge alignment accuracy: ≤±50 μm; Mark alignment accuracy: ≤±2 μm |
| Bonding Strength: | ≥2.0 J/m² @ room temperature (for Si-Si direct bonding) |
| Brand Name | ZMSH |
| Model Number | Wafer Bonding Equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 2
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Compatible Wafer Sizes: | 4 -12inch |
| Compatible Materials: | Si wafer, SiC wafer, SiC ingot |
| Axis orientation: | z-axis |
| Minimum resolution: | 0.1um/s |
| Principal axis: | Water-cooling system |
| Brand Name | ZMSH |
| Model Number | Wafer Precision Thinning Equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 2
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Bonding Methods: | Thermal Pressure Bonding |
| Compatible Wafer Sizes: | 2-8inch |
| Compatible Materials: | Si, Cu, Au, Au-Sn,Al-Ge |
| Maximum temperature: | 600℃ |
| Maximum pressing force: | 100kN, control accuracy ≤±1% |
| Anode voltage and current: | ≤2kv, ≤100mA |
| Brand Name | ZMSH |
| Model Number | Thermo Compression Anodic Bonding Equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Temperature range: | 1300℃ |
| Heating rate: | Up to 100°C/ s |
| Degree of automation: | Fully automatic control system |
| Application: | SIC,GaN and other third generation semiconductor field |
| Brand Name | ZMSH |
| Model Number | Automatic double cavity fast annealing furnace |
| Certification | rohs |
| Place of Origin | CHINA |
Explore more categories
Get in touch with us
Leave a Message, we will call you back quickly!
