Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | Western Union, L/C, T/T |
| Supply Ability | 10000000pcs / per month |
| Packaging Details | inner vacuum package, outer carton box |
| Board size | 1*1.5cm |
| Board THK | 0.6mm |
| Cu THK | 35UM |
| Material | FR4 KB |
| Application | Elevator |
| Layer | 4 |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,FCC,Rohs,ISO9001,SGS,UL |
| Place of Origin | China |
View Detail Information
Explore similar products
200*150mm Green Multi Layered Pcb In Immersion Gold Finished Surface
6 Layer Multilayer PCB Red Solder Mask White Silk Screen For Ultrasonic Wave
Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With
FR4 Multilayer PCB Lead Free HASL 4 Layer Board 200*108mm SGS
Product Specification
| Payment Terms | Western Union, L/C, T/T | Supply Ability | 10000000pcs / per month |
| Packaging Details | inner vacuum package, outer carton box | Board size | 1*1.5cm |
| Board THK | 0.6mm | Cu THK | 35UM |
| Material | FR4 KB | Application | Elevator |
| Layer | 4 | Brand Name | XCE |
| Model Number | XCEM | Certification | CE,FCC,Rohs,ISO9001,SGS,UL |
| Place of Origin | China | ||
| High Light | multilayer pcb fabrication ，multilayer pcb manufacturing | ||
Multilayer Customized PCB Integrated Circuit Board For Elevator
Specification:
| Base Material: Fr4 KB Material |
| Layer:4 |
| Thickness: 0.6MM |
| Copper weight:1OZ |
| Surface finish: HASL LF |
Description:
1. at most 99 floor display, with dynamic show to run direction
2. various input ways, 7 segments, BCD code, Gary code, Binary code, ASCII code
3. display any English letter, like B, overload, inspection, etc.
4. doc matrix display, color can be red, yellow, green and blue
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Quote requirement:
· Gerber file of the bare PCB board
· BOM (Bill of material) for assembly
· To short the lead time, please kindly advise us if there is any acceptable components substitution.
· Testing Guide & Test Fixtures if necessary
· Programming files & Programming tool if necessary
· Schematic if necessary
Parameter:
| Layer No. | 1-16 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
Get in touch with us
Leave a Message, we will call you back quickly!