Payment Terms | T/T,Western union |
Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days |
Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Base material | KB fr4 |
Name | FR4 high speed pcb |
Board thickness | 20mil |
Copper THK | 1OZ |
Board size | 6*3cm |
Surface finish | Immersion gold |
Brand Name | XCE |
Model Number | XCER |
Certification | CE,ROHS, FCC,ISO9008 |
Place of Origin | China |
View Detail Information
Explore similar products
Through Hole Timer Circuit Board / Fr4 PCB Electronic Circuit 1OZ
4 Layer Multiple Gold Fr4 Pcb Industrial Camera Board With Minimum Hole Size Of
TG170 Fan Remote Control Fr4 PCB With Through Hole PCB Prototype
Motor Control Board Battery Protection Circuit In Green Soldermask With Blind
Product Specification
Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Base material | KB fr4 | Name | FR4 high speed pcb |
Board thickness | 20mil | Copper THK | 1OZ |
Board size | 6*3cm | Surface finish | Immersion gold |
Brand Name | XCE | Model Number | XCER |
Certification | CE,ROHS, FCC,ISO9008 | Place of Origin | China |
High Light | pcb manufacturing process ,fr4 circuit board |
Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control
Specification
PCB Type: | FR4 PCB |
Layer : | 4 layer |
Min .Line Width/Space: | 8milmil/8mil |
Min. Via Diameter: | 0.3mm |
Finish Thickness: | 20mil |
Surface Finish: | ENIG |
Size: | 3*6MM |
Material: | KB FR4 |
Color: | green |
Application: | aviation |
High frequency PCB Introduce:
Model | Parameter | thickness(mm) | Permittivity(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
RO4003 | 0.508 | 3.38 | |
TACONIC | TLF-35 | 0.8 | 3.5 |
TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
RF-60A | 0.64 | 6.15 | |
TLY-5 | 0.254,0.508,0.8 | 2.2 | |
TLC-32 | 0.8,1.5,3 | 3.2 | |
TLA-35 | 0.8 | 3.2 | |
ARLON | AD255C06099C | 1.5 | 2.55 |
MCG0300CG | 0.8 | 3.7 | |
AD0300C | 0.8 | 3 | |
AD255C03099C | 0.8 | 2.55 | |
AD255C04099C | 1 | 2.55 | |
DLC220 | 1 | 2.2 |
Parameter
Profile tolerance | ±0.10mm(4mil) | ||||||||
Board bend&warp | ≤0.7% | ||||||||
Insulation resistance | >1012Ωnormal | ||||||||
Through-hole resistance | <300Ωnormal | ||||||||
Electric strength | >1.3kv/mm | ||||||||
Current breakdown | 10A | ||||||||
Peel strength | 1.4N/mm | ||||||||
Soldmask regidity | >6H | ||||||||
Thermal stress | 288℃20Sec | ||||||||
Testing voltage | 50-300v | ||||||||
Min buried blind via | 0.2mm(8mil) | ||||||||
Outer cooper thickness | 1oz-5oz | ||||||||
Inner cooper thickness | 1/2 oz-4oz | ||||||||
Aspect ratio | 8:1 | ||||||||
SMT min green oil width | 0.08mm | ||||||||
Min green oil open window | 0.05mm | ||||||||
Insulation layer thickness | 0.075mm-5mm | ||||||||
Aperture | 0.2mm-0.6mm | ||||||||
Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating |
Description:
FR4 Multi-Layer PCB refer to printed circuit board has more than two copper layers, such as 4L, 6L, 8L, 10L, 12L, etc. As technology improving, people can put more and more copper layers on the same board. Currently, we can produce 20L-32L FR4 PCB.
By this structure, engineer can put trace on different layers for different purpose, such as layers for power, for signal transfering, for EMI shielding, for components assembly, and so on. In order to avoid too many layers, Buried Via or Blind via will be designed in multi-layer PCB. For board more than 8 layers, high Tg FR4 material will be popular than normal Tg FR4.
More layers it is, more complex & difficult the manufacturing will be, and more expensive the cost will be. The lead time of multi-layer PCB is different from normal one, please contact us for accurate leading time.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification:
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
Get in touch with us
Leave a Message, we will call you back quickly!