Payment Terms | T/T,Western union |
Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days |
Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Board THK | 1.0mm |
Surface finish | ENIG |
Origin | China |
Cu thickness | 3OZ |
Min line space and width | 5mil |
Color | green |
Brand Name | XCE |
Model Number | XCES |
Certification | CE,ROHS, FCC,ISO9008,SGS |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Board THK | 1.0mm | Surface finish | ENIG |
Origin | China | Cu thickness | 3OZ |
Min line space and width | 5mil | Color | green |
Brand Name | XCE | Model Number | XCES |
Certification | CE,ROHS, FCC,ISO9008,SGS | Place of Origin | China |
High Light | single side pcb ,single sided pcb board |
Metal Clad Single Sided PCBs Backed PTFE / Micorowave Circuits Maker
Description:
Model: XCES |
Layer: 2 |
Size: 5*9 cm |
Special: Metal clad heavy copper |
Material: FR4 |
Technical Details:
Material: copper basis
layer count: 1-26L
Board thickness: 0.2-3.2mm
Finishing copper thickness: 0.5-4oz
Solder mask:green
Silkscreen:white
Surface Finish: OSP
Flying probe testing: 100%pass
Minimum hole size: 0.2mm
Minimum track width/space: 0.25/0.25mm
Certificates: UL,SGS,ISO9001:2008
Advantage:
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Getek Copper
Clad Thermal Substrates
Hybrid (Rogers and FR4)
BT Epoxy
Nelco 4013
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Layer: 1 to 36 layers
Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness: 0.21mm to 3.4mm
Copper thickness: 0.5 OZ to 4 OZ
Copper thickness in hole: >25.0 um (>1mil)
Size:
- Max. Board Size: (580mm×1200mm)
- Min. Drilled Hole Size: 4mil(0.1mm)
- Min. Line Width: 3mil (0.075mm)
- Min. Line Spacing: 3mil (0.075mm)
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder Mask Color: Green/Yellow/Black/White/Red/Blue
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification:
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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