Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Copper THK | 1OZ |
| Board size | 20*10cm |
| Board THK | 0.2mm |
| Surface finish | Gold plating |
| Brand Name | XCE |
| Model Number | XCER-1 |
| Certification | CE,ROHS, FCC,ISO9008 |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Copper THK | 1OZ | Board size | 20*10cm |
| Board THK | 0.2mm | Surface finish | Gold plating |
| Brand Name | XCE | Model Number | XCER-1 |
| Certification | CE,ROHS, FCC,ISO9008 | Place of Origin | China |
| High Light | Pcb Board Prototype ，Pcb Design And Fabrication | ||
Rogers PCB For 3G / 4G LTE Mobile Base Station Antenna Equipment
Specification:
| Brand: XCE |
| Number of layer: 2 |
| Surface finish: Gold plating |
| Board size: 10*20cm |
| Board thickness: 0.2mm |
| Cu thickness: 1OZ |
| Base material: Rogers4350B |
| Origin: Shenzhen |
Knowledge:
What's difference between immersion gold and gold plating?
Gold plating: Hard gold, electronic gold
Immersion gold: Soft gold, ENIG
Gold plating: using the way of electroless plating, the gold particles are attached to the pcb board, because strong adhesion, also known as hard gold, memory of the finger as hard gold, generally bound pcb also using gold plating.
Immersion gold: through a chemical reaction, crystallization gold particles attached to the pcb pad, because of weak adhesion, also known as soft gold
Parameter
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||
| Finished hole | 0.2mm-6.3mm | ||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||
| Min bonding pad space | 10mil | ||
| PTH aperture tolerance | 10mil | ||
| NPTH aperture tolerance | 10mil | ||
| Hole site deviation | 10mil | ||
| Profile tolerance | ±0.10mm | ||
| Board bend&warp | ≤0.7% | ||
| Insulation resistance | ＞1012Ωnormal | ||
| Through-hole resistance | ＜300Ωnormal | ||
| Electric strength | ＞1.3kv/mm | ||
| Current breakdown | 10A | ||
| Peel strength | 1.4N/mm | ||
| Soldmask regidity | ＞6H | ||
| Thermal stress | 288℃20Sec | ||
| Testing voltage | 50-300v | ||
| Min buried blind via | N/O | ||
| Outer cooper thickness | 3oz | ||
| Inner cooper thickness | 3oz | ||
| Aspect ratio | 8:1 | ||
| SMT min green oil width | 0.08mm | ||
| Min green oil open window | 0.05mm | ||
| Insulation layer thickness | 0.075mm-5mm | ||
| Aperture | 0.2mm-0.6mm | ||
Advantage:
Sufficient rogers material raw,promopt response and delivery time.
24 hours online quotation service
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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