Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 1000000 pieces per week |
| Delivery Time | 5-10 working days |
| Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
| Color | White and yellow |
| Material | Rogers Material |
| Layer | multilayer |
| Board Size | 12*4cm |
| Copper Thinknes | 1 oz |
| Min Line Width | 5 mil |
| Min Line Space | 5 mil |
| Surface Finish | Immersion gold |
| Name | Rogers pcb |
| Brand Name | XCE |
| Model Number | rogers 3003 |
| Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 1000000 pieces per week |
| Delivery Time | 5-10 working days | Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
| Color | White and yellow | Material | Rogers Material |
| Layer | multilayer | Board Size | 12*4cm |
| Copper Thinknes | 1 oz | Min Line Width | 5 mil |
| Min Line Space | 5 mil | Surface Finish | Immersion gold |
| Name | Rogers pcb | Brand Name | XCE |
| Model Number | rogers 3003 | Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | Pcb Design And Fabrication ，Printing Circuit Boards | ||
Multilayer RF Ro3003 Rogers PCB Power Amplifier Circuit Board
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :12*4 cm
5. Permittivity : 3
6. Surface finish : Immersion gold
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 3 dielectric conductivity much more precision .
Description :
RO3003™ high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.
Typical Applications:
Production Description :
| XCE PCB technical specifications | ||
| Annual stock Material | Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free | |
| Layer No. | 1~16 | |
| Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
|
| Max panel size | 508*610mm | |
| Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% | |
| Wall hole copper thickness | >0.025mm(1mil) | |
| Finished hole | 0.2mm-6.3mm | |
| Min line width | 4mil/4mil(0.1/0.1mm) | |
| Min bonding pad space | 0.1mm(4mil) | |
| PTH aperture tolerance | ±0.075mm(3mil) | |
| NPTH aperture tolerance | ±0.05mm(2mil) | |
| Hole site deviation | ±0.05mm(2mil) | |
| Profile tolerance | ±0.10mm(4mil) | |
| Board bend&warp | ≤0.7% | |
| Insulation resistance | >1012Ωnormal | |
| Through-hole resistance | <300Ωnormal | |
| Electric strength | >1.3kv/mm | |
| Current breakdown | 10A | |
| Peel strength | 1.4N/mm | |
| Soldmask regidity | >6H | |
| Thermal stress | 288℃20Sec | |
| Testing voltage | 50-300V | |
| Min buried blind via | 0.2mm(8mil) | |
| Outer copper thickness | 1oz-5oz | |
| Inner cooper thickness | 1/2 oz-4oz | |
| Aspect ratio | 8:1 | |
| SMT min green oil width | 0.08mm | |
| Min green oil open window | 0.05mm | |
| Insulation layer thickless | 0.075mm-5mm | |
| Taphole aperture | 0.2mm-0.6mm | |
| Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB | |
| Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating | |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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