Payment Terms | T/T,Western union |
Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days |
Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Material | FR4 |
Layer | 4 |
Color | Green |
Min line space | 5mil |
Min line width | 5mil |
Copper thickness | 1OZ |
Board size | 105*50mm |
Panel | 1 |
Surface | ENIG |
Brand Name | XCE |
Model Number | XCEM |
Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Material | FR4 | Layer | 4 |
Color | Green | Min line space | 5mil |
Min line width | 5mil | Copper thickness | 1OZ |
Board size | 105*50mm | Panel | 1 |
Surface | ENIG | Brand Name | XCE |
Model Number | XCEM | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
Place of Origin | China | ||
High Light | pcb maker ,printed circuit board manufacturing |
TG170 PCB Board For Washing Machine Controller
Quick detail:
Origin:China | Special: FR4 Material |
Layer:4 | Thickness:1.6mm |
Surface: ENIG | Hole:0.8 |
Specification:
High Tg represents: a high heat resistance. Usually high Tg of 130 degrees or more plates, excellent high Tg is generally greater than 170 degrees, moderate Tg greater than about 150 degrees, PCB boards normally Tg≥170 ℃, called high Tg PCB. With the rapid development of the electronics industry, especially in the computer as the representative of electronic products toward high performance, high multi-layered development requires a higher heat resistance as an important guarantee of PCB substrate material. The emergence and development of SMT, CMT, represented by high-density mounting technology, the PCB in a small aperture, fine lines, thin side, high heat resistance become increasingly dependent on the substrate support
Typical Applications
Tg of the substrate is increased, PCB thermal resistance, moisture resistance, chemical resistance, stability and other characteristics will improve and improve. TG higher the value, the better the sheet temperature resistance, especially in the lead-free process, the high Tg applications more
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
RO5880 | 0.254.0.508.0.762 | 2.2 | |
RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
RO3010 | 0.635 | 10.2 | |
RO3206 | 0.635MM | 10.2 | |
R03035 | 0.508MM | 3.5 | |
RO6010 | 0.635MM, 1,27MM | 10.2 |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification:
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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