Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | Isola420 |
| Layer | 2 |
| Color | Green |
| Min line space | 2mil |
| Min line width | 2mil |
| Copper thickness | 1OZ |
| Board size | 5*6cm |
| Panel | 4*2 |
| Surface | ENIG |
| Brand Name | XCE |
| Model Number | XCEH |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | Isola420 | Layer | 2 |
| Color | Green | Min line space | 2mil |
| Min line width | 2mil | Copper thickness | 1OZ |
| Board size | 5*6cm | Panel | 4*2 |
| Surface | ENIG | Brand Name | XCE |
| Model Number | XCEH | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | printed circuit board manufacturing ，pcb maker | ||
Isola Laminate Prepreg High TG PCB Circuit Board Design Prototype
| Origin:China | Special: 2mil line width and space |
| Layer:2 | Thickness:0.7mm |
| Surface: ENIG | Hole:0.8 |
Specification:
370HR Laminate and Prepreg
370HR is a high performance 180°C glass transition temperature
(Tg) FR-4 system for multilayer Printed Wiring Board (PWB)
applications where maximum thermal performance and reliability
are required. 370HR laminate and prepreg products are
manufactured with a unique high performance multifunctional
epoxy resin, reinforced with electrical grade (E-glass) glass fabric.
This system provides improved thermal performance and low
expansion rates in comparison to traditional FR-4 while retaining
FR-4 processability.
In addition to this superior thermal performance, the mechanical,
chemical and moisture resistance properties all equal or exceed
the performance of traditional FR-4 materials. The 370HR system
is also laser fluorescing and UV blocking for maximum compatibility
with Automated Optical Inspection (AOI) systems, optical positioning
systems and photoimagable solder mask imaging.
370HR has proven to be best in class for sequential lamination
• Polyimidemprodesu-highennalperfonnanwith
Tg>2C (TMA)Td >405C%1 sTGAa)nd T300>60min.
• Lω'erZs CTE of 1.20% ( 50-260C) offering superior PTH reliability.
• Maini mechani 1 strength and bonding sngth at high temperature.
• Tough resin systemNon-MOAemist
• Haelfrree chemistry mpatible withe1 pro sslng.
RoHSJWEEE mpliant.
• IPC4101D.0/41
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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