Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 |
| Layer | 6 |
| Color | Green |
| Min line space | 5mil |
| Min line width | 5mil |
| Copper thickness | 1OZ |
| Board size | 179*45mm |
| Panel | 1 |
| Surface | ENIG |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 | Layer | 6 |
| Color | Green | Min line space | 5mil |
| Min line width | 5mil | Copper thickness | 1OZ |
| Board size | 179*45mm | Panel | 1 |
| Surface | ENIG | Brand Name | XCE |
| Model Number | XCEM | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | fr4 circuit board ，Custom Printed Circuit Board | ||
0.8mm Thick Electronic Scale Fr4 PCB / 94V0 Electronic printed circuit board assembly
Quick detail:
| Origin:China | Special: FR4 Material |
| Layer:6 | Thickness:1.6mm |
| Surface: ENIG | Hole:0.5 |
Specification:
Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
General FR-4 differs from high Tg FR-4: in the hot state, especially in the heat after moisture absorption, the mechanical strength of the material, dimensional stability, adhesion, water absorption, thermal decomposition, differences in thermal expansion and other various conditions, high Tg products significantly better than conventional PCB substrate material.
What is Immersion Gold: The method of reduction reaction by chemical oxidation coating layer, generally thicker, a chemical nickel gold layer deposition method can achieve a thicker layer of gold, usually called Immersion Gold.
Immersion Gold is gold-plated crystal structure than the more dense and difficult to produce an oxide.
As more and more dense wiring, line width, spacing has to 3-4MIL. Gilded gold is prone to short-circuiting. Only nickel immersion gold plate gold on the pad, it will not yield to the gold shorts.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
UL 94: Test for Flammability of Plastic Materials for Parts in Devices and Appliances
Level test program are as follows:
1) HB Grade: horizontal burning test Horizontal Burning Test
2) V0-V2 level: vertical flame test Vertical Burning Test
3) 5VA / 5VB: 5V-fire test 500w (125 mm) Vertical Burning Test
4) RP Class: radiant panel flame spread testing Radiant Panel Flame Spread Test
5) VTM0-VTM2: thin material vertical combustion test Thin Material Vertical Burning Test
6) HF1-HF2: foam level material combustion test Horizontal Burning Foamed Material Test
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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