Payment Terms | T/T, Western Union |
Supply Ability | 1000000 pieces per week |
Delivery Time | 5-10 working days |
Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
Color | Green |
Material | Rogers Mixed Material |
Layer | Multilayer |
Board Size | 12*12cm |
Copper Thinknes | 2 oz |
Min Line Width | 4 mil |
Min Line Space | 4mil |
Surface Finish | Immersion Gold Over Nickel, Carbon Print |
Drill | Blind & Buried Vias |
Name | Rogers Mixed Fr4 Pcb |
Brand Name | XCE |
Model Number | XCE RT |
Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union | Supply Ability | 1000000 pieces per week |
Delivery Time | 5-10 working days | Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
Color | Green | Material | Rogers Mixed Material |
Layer | Multilayer | Board Size | 12*12cm |
Copper Thinknes | 2 oz | Min Line Width | 4 mil |
Min Line Space | 4mil | Surface Finish | Immersion Gold Over Nickel, Carbon Print |
Drill | Blind & Buried Vias | Name | Rogers Mixed Fr4 Pcb |
Brand Name | XCE | Model Number | XCE RT |
Certification | CE,ROHS,FCC,ISO9008,SGS,UL | Place of Origin | China |
High Light | Quick Turn Pcb Fabrication ,lead free pcb |
RFID Sensor Remote Control SHF Rogers Pcb Board For Gps Tracking In Radar Systerm ER 2.2
Products Details
Raw Material | Rogers |
Layer Count | Multilayer |
Board Thickness | 0.8mm |
Copper Thickness | 2 oz |
Surface Finish | Immersion Gold Over Nickle |
Solder Mask | Green |
Silkscreen | White |
Min. Trace Width/Spacing | 0.075/0.075mm |
Min. Hole Size | 0.25mm |
Hole Wall Copper Thickness | ≥20μm |
Measurement | 120*120mm |
Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
Application | Communication,automobile,cell,computer,medical |
Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PCB Capability
Layer | 1-30L |
Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb . |
Board Thinckness | 0.2-6mm |
Max Finish Size | 800*508mm |
Min. Drill Hole Size | 0.25mm |
Min. Line Width | 0.075mm(3mil) |
Min. Line Spacing | 0.075mm(3mil) |
Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
Copper thickness | 0.5-4.0 Oz |
Solder mask color | green/black/white/red/blue/yellow |
Inner packing | Vacuum packing, Plastic Bag |
Outer packing | standard carton packing |
Hole tolerance | PTH:±0.076,NTPH:±0.05 |
Certificate | ISO9001,SGS |
Profiling punching | Routing,V-CUT,Beveling |
PrePreg Material
Parameter | Value |
Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) |
Water absorption | −0.125 in < 0.10% |
Temperature index | 140 °C (284 °F) |
Thermal conductivity, through-plane | 0.29 W/(m·K), 0.343 W/(m·K) |
Thermal conductivity, in-plane | 0.81 W/(m·K), 1.059 W/(m·K) |
Rockwell hardness | 110 M scale |
Bond strength | > 1,000 kg (2,200 lb) |
Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) |
Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) |
Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) |
Izod impact strength - LW | > 54 J/m (10 ft·lb/in) |
Izod impact strength - CW | > 44 J/m (8 ft·lb/in) |
Compressive strength - flatwise | > 415 MPa (60,200 psi) |
Dielectric breakdown (A) | > 50 kV |
Dielectric breakdown (D48/50) | > 50 kV |
Dielectric strength | 20 MV/m |
Relative permittivity (A) | 4.8 |
Relative permittivity (D24/23) | 4.8 |
Dissipation factor (A) | 0.017 |
Dissipation factor (D24/23) | 0.018 |
Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
Glass transition temperature | Can vary, but is over 120 °C |
Young's modulus - LW | 3.5×106 psi (24 GPa) |
Young's modulus - CW | 3.0×106 psi (21 GPa) |
Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 |
Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 |
Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 |
Poisson's ratio - LW | 0.136 |
Poisson's ratio - CW | 0.118 |
LW sound speed | 3602 m/s |
SW sound speed | 3369 m/s |
LW Acoustic impedance | 6.64 MRayl |
Compared Data :
Model | ER | Tanδ@ 1GHz | Cter (ppm/℃) | CTE (X,Y) (ppm/℃) | |
FR4 | Normal | 4.6 | 0.030 | 17 | |
FR4 | PCL370(FR4-HTG) | 4.3 | 0.0015 | 51 | 17 |
FR4 | 117 (FR4-HTG) | 4.4 | 0.013 | 17 | |
Park Neclo | N4000-6-FC BC (FR4-HTG) | 4.1 | 0.0015 | 16 |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Detail :
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification:
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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