Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T, Western Union |
| Supply Ability | 1000000 pieces per week |
| Delivery Time | 5-10 working days |
| Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
| Color | Green |
| Material | F4B Material |
| Layer | Multilayer |
| Board Size | 21*21cm |
| Copper Thinknes | 2 oz |
| Min Line Width | 4 mil |
| Min Line Space | 4mil |
| Surface Finish | Immersion Gold Over Nickel, Carbon Print |
| Drill | Blind & Buried Vias |
| Original | China |
| Name | F4B Pcb |
| Brand Name | XCE |
| Model Number | XCE G1 |
| Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Western Union | Supply Ability | 1000000 pieces per week |
| Delivery Time | 5-10 working days | Packaging Details | 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package |
| Color | Green | Material | F4B Material |
| Layer | Multilayer | Board Size | 21*21cm |
| Copper Thinknes | 2 oz | Min Line Width | 4 mil |
| Min Line Space | 4mil | Surface Finish | Immersion Gold Over Nickel, Carbon Print |
| Drill | Blind & Buried Vias | Original | China |
| Name | F4B Pcb | Brand Name | XCE |
| Model Number | XCE G1 | Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | Quick Turn Pcb Fabrication ，lead free pcb | ||
Multilayer High Frequency RF Microwave F4B Pcb Board 0.38 MM ER = 2.2
Products Details
We are the highest efficience pcb manufature here .
(1) Professional Manufacturer on PCB for about 10 years
(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.
(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification
| Feature | Parameter (in) |
| Surface processing | Lead- Free HASL/Plating gold / immersion gold /Plating gold finger/OSP |
| Layers | 1~24 layers |
| Copper Thickness | O.5OZ~10OZ |
| Board Thickness Range | 14~276mil |
| Min Hole Size | 3mil |
| Impedance Control | ±5% |
| Flammability | 94V-0 |
| Warp & Twist | ≦0.7% |
| Thermal Shock | 5×10Sec@288 |
| Aspect Radio | 18:1 |
| Min Line Width/Space | 2mil /2mil |
| PTH Dia. Tolerance | ±2mil |
| NPTH Dia. Tolerance | ±1mil |
| Hole Position Deviation | ±3mil |
| Outline Tolerance | ±4mil |
| S/M Pitch | 3mil |
| HDI Capability | Any layer |
OME Manufature
a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.
b. Expert circuit board testing, high quality factory wholesale price
c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS
We offer our customers a wide range material and boards:
1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB
2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available
3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)
4. Aluminum PCB board thickness from 0.8mm-3.6mm
5. Quantity from prototype to volume production
6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing
| Raw Material | F4B |
| Layer Count | Multilayer |
| Board Thickness | 0.38 mm |
| Copper Thickness | 2 oz |
| Surface Finish | Immersion Gold Over Nickle |
| Solder Mask | Green |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 210*210mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PrePreg Material
| Parameter | Value |
| Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption | −0.125 in < 0.10% |
| Temperature index | 140 °C (284 °F) |
| Thermal conductivity, through-plane | 0.29 W/(m·K), 0.343 W/(m·K) |
| Thermal conductivity, in-plane | 0.81 W/(m·K), 1.059 W/(m·K) |
| Rockwell hardness | 110 M scale |
| Bond strength | > 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) |
| Izod impact strength - LW | > 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW | > 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise | > 415 MPa (60,200 psi) |
| Dielectric breakdown (A) | > 50 kV |
| Dielectric breakdown (D48/50) | > 50 kV |
| Dielectric strength | 20 MV/m |
| Relative permittivity (A) | 4.8 |
| Relative permittivity (D24/23) | 4.8 |
| Dissipation factor (A) | 0.017 |
| Dissipation factor (D24/23) | 0.018 |
| Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature | Can vary, but is over 120 °C |
| Young's modulus - LW | 3.5×106 psi (24 GPa) |
| Young's modulus - CW | 3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 |
| Poisson's ratio - LW | 0.136 |
| Poisson's ratio - CW | 0.118 |
| LW sound speed | 3602 m/s |
| SW sound speed | 3369 m/s |
| LW Acoustic impedance | 6.64 MRayl |
Compared Data :
| Model | ER | Tanδ@ 1GHz | Cter (ppm/℃) |
CTE (X,Y) (ppm/℃) |
|
| FR4 | Normal | 4.6 | 0.030 | 17 | |
| FR4 | PCL370(FR4-HTG) | 4.3 | 0.0015 | 51 | 17 |
| FR4 | 117 (FR4-HTG) | 4.4 | 0.013 | 17 | |
| Park Neclo | N4000-6-FC BC (FR4-HTG) | 4.1 | 0.0015 | 16 |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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