Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 |
| Layer | 4 |
| Color | Black |
| Min line space | 4mil |
| Min line width | 4mil |
| Copper thickness | 1OZ |
| Board size | 80*80mm |
| Panel | 1 |
| Surface | ENIG |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 | Layer | 4 |
| Color | Black | Min line space | 4mil |
| Min line width | 4mil | Copper thickness | 1OZ |
| Board size | 80*80mm | Panel | 1 |
| Surface | ENIG | Brand Name | XCE |
| Model Number | XCEM | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China | ||
| High Light | pcb manufacturing process ，fr4 circuit board | ||
Multilayer Rigid PCB/ Hiigh-Density 8-Layer PCB PLC Power Circuit Board
Quick detail:
| Origin:China | Special: FR4 Material |
| Layer:8 | Thickness:1.6mm |
| Surface: ENIG | Hole:0.5 |
Specification:
Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
BGA's full name Ball Grid Array (solder ball array package), which is in the bottom of the package substrate array solder ball as the circuit I / O terminals and printed circuit board (PCB) interconnection. The device using this technology is a surface mount device package.
PBG (Plastic Ball Grid Array), which uses BT resin / glass laminate as the substrate, plastic (epoxy molding compound) as the sealing material, solder ball can be divided into lead solder (63Sn37Pb, 62Sn36Pb2Ag) and lead-free solder Sn96.5Ag3Cu0.5), solder ball and package connections do not require additional use of solder.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
| 1 | Layers | Single Sided,2 to 18 Layer |
| 2 | Board material type | FR4,Rogers,Taconic,F4B,Isola,Nelco and more |
| 3 | Compound material lamination | 4 to 6 layers |
| 4 | Maximum dimension | 610 x 1,100mm |
| 5 | Dimension tolerance | ±0.13mm |
| 6 | Board thickness coverage | 0.2 to 6.00mm |
| 7 | Board thickness tolerance | Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% |
| 8 | DK thickness | 0.076 to 6.00mm |
| 9 | Minimum line width | 0.10mm |
| 10 | Minimum line space | 0.10mm |
| 11 | Outer layer copper thickness | 8.75 to 175µm |
| 12 | Inner layer copper thickness | 17.5 to 175µm |
| 13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
| 14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
| 15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
| 16 | Hole position tolerance (mechanical drill) | 0.075mm |
| 17 | Laser drill hole size | 0.10mm |
| 18 | Board thickness and hole diameter ratio | 10:01 |
| 19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
| 20 | Minimum solder mask | Ø0.10mm |
| 21 | Minimum size of solder mask separation ring | 0.05mm |
| 22 | Solder mask oil plug hole diameter | 0.25 to 0.60mm |
| 23 | Impedance control tolerance | ±10% |
| 24 | Surface finish | Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger |
| 25 | Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
| 26 | Acceptable file format | Gerber file,PROTEL series,PADS series,POWER PCB series,AutoCAD |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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