Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | Rogers |
| Layer | 4 |
| Color | Gold |
| Min line space | 5mil |
| Min line width | 5mil |
| Copper thickness | 1OZ |
| Board size | 199*59mm |
| Panel | 1 |
| Surface | ENIG |
| Other | Impedance Control |
| Brand Name | XCE |
| Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | Rogers | Layer | 4 |
| Color | Gold | Min line space | 5mil |
| Min line width | 5mil | Copper thickness | 1OZ |
| Board size | 199*59mm | Panel | 1 |
| Surface | ENIG | Other | Impedance Control |
| Brand Name | XCE | Model Number | XCEM |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL | Place of Origin | China |
| High Light | Pcb Board Prototype ，Printing Circuit Boards | ||
Transmitting Antenna Rogers 4003 Multi Layer Pcb Board With ENIG Surface
Key specifications:
Material: Rogers
Layer: 4 Layer
Copper thickness: 1oz
Surface finish: Immersion Gold
Size:199*59mm
Buried and blind hole: no
Application: gas detector, remote control, telecommunication products
Reference - our production capability for rigid PCB:
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Materials: FR4,Rogers,Taconic
Max. finished board size: 23 x 25 (580 x 900mm)
Min. drilled hole size: 3mil (0.075mm)
Min. line width: 3mil (0.075mm)
Min. line spacing: 3mil (0.075mm)
Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
Immersion Silver/gold,OSP, gold plating
Copper thickness: 0.5-7.0oZ
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0µm (>1mil)
Inner packing: Vacuum packing/plastic bag
Outer packing: Standard carton packing
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
Special requirements: buried and blind Vias + controlled impedance + BGA
Profiling: Punching, routing, V-CUT, beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
Main Export Markets:
Eastern Europe
North America
Mid East/Africa
Western Europe
Asia
Central/South America
Primary Competitive Advantages:
Experienced Staff
Green Product
Packaging
Price
Prompt Delivery
Quality Approvals
Small Orders Accepted
Parameter:
o Item Data
1 Layer: 1 to 24 layers
2 Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness:0.20mm to 3.4mm
4 Copper thickness:0.5 OZ to 4 OZ
5 Copper thickness in hole:>25.0 um (>1mil)
6 Max. Board Size:(580mm×1200mm)
7 Min. Drilled Hole Size:4mil(0.1mm)
8 Min. Line Width:3mil (0.075mm)
9 Min. Line Spacing:3mil (0.075mm)
10 Surface finishing:HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:±0.13
13 Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14 Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate:UL,SGS,ISO 9001:2008
16 Special requirements:Buried and blind vias+controlled impedance +BGA
17 Profiling:Punching, Routing, V-CUT, Beveling
Applications:
Amplifier Combiner Coupler Mixer Multiplexer Power divider WiFi
WiMAX, LTE bands 3G and 4G antenna
Typical Applications:
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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