Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 High TG PCB |
| Layer | 4 |
| Color | GREEN |
| Min line space | 10mil |
| Min line width | 10mil |
| Copper thickness | 1OZ |
| Size | 6*4 cm |
| Board THK | 1.6MM |
| Panel | 3*4 |
| Surface finish | Immersion gold |
| Model | XCEH |
| Brand | XCE |
| Brand Name | XCE |
| Model Number | XCEH |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Material | FR4 High TG PCB | Layer | 4 |
| Color | GREEN | Min line space | 10mil |
| Min line width | 10mil | Copper thickness | 1OZ |
| Size | 6*4 cm | Board THK | 1.6MM |
| Panel | 3*4 | Surface finish | Immersion gold |
| Model | XCEH | Brand | XCE |
| Brand Name | XCE | Model Number | XCEH |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL | Place of Origin | China |
| High Light | pcb maker ，printed circuit board manufacturing | ||
4 Layer Circuit Boards High TG PCB High Thermal Conductivity Specification
Testing Procedures For PCB Board:
We perform multiple quality assuring procedures before shipping out any PCB board.
These include:
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
* AOI (Automated Optical Inspection)
Quotation Requirement :
a) Base material
b) Board thickness
c) Copper thickness
d) Surface treatment
e) color of solder mask and silkscreen
f) Quantity
Our Manufacturing Capability
| Item | Capability | Item | Capability |
| Layer | 1-12L | Min.Finished Hole | 0.1mm |
| Board Thickness | 0.3-3.2mm | PTH/NPTH Tolerance | ±0.076mm ±0.05mm |
| Laminate Type | FR-4 Halogen free High TG | Hole Cu.Thickness | ≥25μm |
| Laminate Brand | Shengyi,Nanya | Min.Dielectrical Thickness | 0.0635mm |
| CuFoil Thickness | 1/2 - 4oz | Layer Misregistration | ±0.076mm |
| Peel Strength | ≥12.3 N/cm | Min.Solder Mask Dam | 0.05mm |
| Max.Panel Size | 600mm * 700mm | Min.Legend Width | 0.10mm |
| Min.Line Width/Space | 0.075mm/ 0.075mm | Warp&Twist | ≤0.5% |
| Min.Annular Ring | ≥0.125mm | Aspect Ratio | 8:01 |
| Impedance Control | ±8% | Surface Finish | HAL LF,ENIG, |
| Imm.Tin/Silver,OSP |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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